Engineer, Process (Die Prep)

Position Summary

The Process Engineer (Die Prep) is responsible for development and establishment of production process.  

Responsibilities

• Establish, review and update specifications, workflow, quality and safety related documentation for Die Prep (Backgrind, Dicing, Laser Grooving, etc) processes within production line.  

• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.  

• Process sustaining and control through SPC and periodic defect Pareto Analysis.  

• Lead and drive SPC control  

• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.  

• Handle and manage customer audits and 8D reports.  

• Provide disposition for engineering and production lots.  

• Conduct process characterization and qualification to establish process baseline.  

• Coordinate and liaise with vendor/suppliers on process issue or quality issue.  

• Support customer NPI activities and internal engineering activities.  

• New material, process & machine development and qualification.  

• Review and accept machine buyoff, setup pilot line process and transfer from pilot to production line 
  

Requirements

• Minimum Degree in Electrical & Electronics, Microelectronics, Mechanical engineering or relevant engineering discipline  

• Experience in Semiconductor manufacturing industry and working in cleanroom environment  

• Minimum 3 years hands-on Die Prep process such as Backgrind, Dicing, Laser Grooving within semiconductor / electronics manufacturing industry 

• Experience in SPC, DOE, FEMA, and 8D reports