Lead Staff Mechanical Engineer-FEA

 In this role as a Staff Mechanical Engineer – Technical Lead, you'll be at the forefront of designing next-generation optical pluggable modules. You'll collaborate within a dynamic team of skilled engineers, fostering an innovative environment where your expertise shapes breakthrough solutions. Your work will involve hands-on engineering, from simulations to prototyping, ensuring products meet industry standards. You'll enjoy a supportive culture that emphasizes professional growth and knowledge sharing. Benefits include a competitive salary, flexible work arrangements, health and wellness programs, and opportunities for continuous learning. Join us to make a meaningful impact on global connectivity while being supported by a collaborative and forward-thinking team.

 

 Design and develop mechanical components for optical pluggable modules, focusing on thermal, structural, and manufacturability aspects.

• Perform and supervise thermal simulations and finite element analysis (FEA) to optimize designs.
• Collaborate with system integration teams to create innovative die interconnect solutions exceeding 140GHz bandwidth.
• Create and review CAD models and detailed engineering drawings for precision manufacturing.
• Conduct tolerance and stress analyses, along with thermal design validation testing (DVT).
• Develop prototypes and facilitate the transition from design to production, minimizing redesign efforts.
• Engage with suppliers and contract manufacturers to troubleshoot mechanical and integration challenges.

Author and review engineering change orders (ECOs), bill of materials (BOMs), and technical documentation.

Must-Have:

• Bachelor’s or Master’s degree in Mechanical Engineering
• 10+ years of experience in mechanical design, particularly with optical or telecom hardware
• Strong expertise in thermal design, FEA, and CAD modeling (Creo preferred)
• Proficiency in conducting die stress/strain simulations
• Excellent communication and leadership skills

Nice-To-Have:

• Experience with optical transceiver packaging (e.g., QSFP, OSFP)
• Knowledge of compliance and shock/vibration testing for telecom applications
• Familiarity with advanced substrate technologies like LTCC and HTCC
• Experience in new product introduction (NPI) processes