Senior Process Engineer - Advanced Packaging

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Senior Process Engineer 3D Integration/Advanced Packaging 

ASM is a leading global supplier of products, services, and materials for semiconductor processing. For more than half a century, innovation has been at the core of everything we do. Our smart, ambitious people are dedicated to creating cutting-edge solutions for the world’s leading semiconductor providers. Every day we push the development of next-generation computer-chip technology, always staying a few steps ahead of what’s next.

he talented, enthusiastic people at ASM are just like you: dedicated to improving people’s lives and unlocking new potential. With our collaborative approach to R&D, we advance key semiconductor technologies and platforms like ALD, epitaxy, PEALD, PECVD, and vertical furnaces. And we have recently entered the promising high-growth market: silicon carbide epitaxy. Year after year, our innovations help to make chips smaller, faster, and more powerful. In fact, you will find our technology in every aspect of modern life: in AI, medical equipment, 5G, smartphones, autonomous driving, and more. 

We are looking for a talented individual to join our Corporate Research & Development Team in Helsinki, FINLAND. In the role of Senior Process Engineer we want you to learn, grow, and bring in your unique set of skills to develop groundbreaking innovations in the field of atomic layer deposition (ALD). You will work alongside your colleagues, putting your expertise in chemistry, material science and process engineering into action in order to innovate: From idea creation to integrated process flows, enabling us to make a difference and create value for our internal and external customers. Besides technical excellence, we are looking for people who share our values, help each other, and communicate clearly across teams and organizations. Your effort today will define the world of tomorrow.

Take a closer look at the responsibilities:

• Strategic Leadership: Spearhead the development and implementation of strategies for seamless device integration, ensuring unmatched performance and efficiency.


• Innovation Catalyst: Innovate and develop new thin film processes and applications in the areas of logic devices, interconnect, 3D integration and advanced packaging.


• Experimental Proficiency: Design and conduct experiments, measurements and drive conclusions out of complex experimental data sets.


• Process Optimization: Work hands-on with state-of-the-art semiconductor process equipment and optimize processes alongside the hardware for maximum efficiency.


• Collaborative Synergy: Communicate effectively with other ASM and customers R&D teams to understand and define requirements in order to successfully execute projects and demonstrations.


• Global Influence: Ensure successful product transfers to customers by performing demonstrations, knowledge transfer, and traveling when needed to support other ASM sites.

We could be a great match for each other if you have:

• A PhD degree in physics, chemistry, chemical engineering or materials science, preferably with a thesis related to the semiconductor (or adjacent industries)

• 3+ years of experience in semiconductor processing and/or device integration.


• Knowledge of 3D integration (W2W, D2W bonding) and/or advanced packaging applications (memory-on-memory, logic-on-memory, imager stacking, Low Temperature devices, ...) is preferred.


• Prior experience with thin film deposition techniques (e.g., ALD, CVD) and their characterization methods (e.g., CSAM, WCA, XPS, AFM, XRD, XRF, electrical characterization and ellipsometry)


• A pragmatic and hands-on approach combined with the ability to work independently. 


• Demonstrated understanding of semiconductor physics, processing equipment technology, device integration and/or advanced chemistries


• A curious mindset, able to synthesize the complex and drive pragmatic solutions forward.


• The Ability to plan, execute and communicate projects from beginning to end and across stakeholders.


• An empathic personality who adapts well with different cultures and working styles 


• Excellent verbal and written communication skills, with ability to clearly communicate advanced technical constructs.

Disclaimer: The internal job title for this role will be in line with our matrix structure and will depend on seniority.