Principal Process Engineer

The Principal Process Engineer is a senior technical leader within the Malaysia IL Wafer Process Engineering organization, responsible for providing high‑level, self‑driven project leadership and deep subject matter expertise in post‑Fab wafer processing. This role focuses on wafer backgrind, thinning, and metallization processes critical to successful die assembly, test, and long‑term product reliability. The incumbent leverages strong technical depth, data‑driven methodologies, and emerging AI‑enabled analytics to optimize manufacturing performance, influence executive‑level decisions, and drive continuous improvement across the end‑to‑end semiconductor manufacturing flow.

Education

• Bachelor’s degree in Engineering, Materials Science, Physics, Data‑enabled Engineering, or a related discipline is required.


• Post‑graduate degree (Master’s or PhD) is an advantage.

Experience

• Minimum 10 years of relevant semiconductor or academic experience in wafer processing, post‑Fab manufacturing, assembly/test integration, or related research roles.


• Demonstrated experience applying data analytics, statistical methods, or AI‑assisted tools in semiconductor manufacturing, process engineering, or reliability analysis is strongly preferred.

Skills & Competencies

• Deep technical expertise in wafer backgrind, thinning, metallization, and post‑Fab process integration.


• Strong working knowledge of AI‑enabled manufacturing analytics, including trend detection, process monitoring, yield learning, or decision‑support tools (coding expertise not mandatory).


• Advanced data analysis, problem‑solving, and executive‑level presentation skills.


• Excellent verbal and written communication skills, with the ability to influence technical and non‑technical stakeholders.


• Proven ability to work independently while driving results through cross‑functional and global collaboration.