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Senior Process Technician (Die Prep, Wirebond, Die Attach, Mold, STF, Test)

Penerangan Pekerjaan - Senior Process Technician (Die Prep, Wirebond, Die Attach, Mold, STF, Test)

Description

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Texas Instruments is seeking an experienced Process Technician to join our team supporting one of our clean rooms. This technician will be an invaluable part of the team, interfacing and communicating with engineering and manufacturing groups across the fab to ensure all issues are solved appropriately and efficiently. Additionally, you will provide process and product support to the organization and address production concerns and disposition of production material.

Responsibilities include:



  • Perform technical tests and experiments for engineering in the wafer fabrication area of semiconductor manufacturers

  • Monitor, audit and provide guidance to line operators once the product is on the line

  • Test new products and provide technical assistance to process development and engineering personnel



Qualifications

Minimum requirements:



  • Diploma in any technical related field, or any engineering relevant background

  • Minimum 5 years of experiences in semiconductor field with experiences in wirebond, die bond, die prep, trim&form, mold, or test as process technicians


Preferred qualifications:



  • Ability to identify, multi-task, and resolve multiple priority issues quickly and efficiently to improve overall ATperformance

  • Ability to learn and understand process flow quickly, and support the engineering organization as needed

  • Outstanding organizational, teaming, and troubleshooting skills on electrical and mechanical systems

  • Exceptional attention to detail



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Texas Instruments Incorporated

Why TI? Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We're different by design. Diverse backgrounds and perspectives are what push innovation forward and wh...

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