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Kandou is redefining AI infrastructure through innovative interconnect technologies that significantly reduce power consumption while maintaining high bandwidth and ultra-low latency. Our mission is to make AI systems more scalable, efficient, and accessible.
Today we have one internship position available for max 6 months, in our Advanced R&D, for MSc students in the following area :
Communication System Modelling Intern
Internship Background
Modern computing systems increasingly rely on high-speed serial interfaces to transfer large volumes of data between processors, memory devices, and accelerator chips. Simultaneous bidirectional (SBD) signalling enables both ends of a copper channel to transmit and receive data concurrently over the same physical medium, offering a promising path toward higher bandwidth efficiency without increasing the number of interconnects.
Project Objectives
The objective of this internship is to investigate circuit and signal-processing techniques that enable simultaneous bidirectional communication over wideband copper serial links. The student will explore methods for separating the locally transmitted signal from the incoming signal while maintaining high data rates and robust link performance.
Specific goals may include:
Expected Outcomes
At the end of the internship, the student is expected to:
Depending on the progress and interests of the student, the work may lead to conference or journal publication opportunities.
Desired Background
The project is suitable for motivated Master's students in Electrical Engineering, Communications Engineering, or Computer Engineering.
Preferred qualifications:
If you recognize yourself in the description above, and love to be part of a growing Company, are a good team player with an upbeat approach to life, we would love to hear from you. Together We Kandou It!
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