Digital Failure Analysis Engineer (LFAB)

Join the Revolution in Semiconductor Manufacturing at LFAB!

Texas Instruments is seeking a skilled Digital Failure Analysis (FA) engineer to join their team in Lehi, Utah. We're at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state-of-the-art 300mm, 65nm, 45nm and 28nm analog and embedded wafer manufacturing facilities are driving production of a diverse semiconductor portfolio in the heart of the Silicon Slopes. 

Responsibilities include:

• Digital FA & Root Cause Analysis: Approach complex failures with a passion for problem-solving and a mindset that pushes boundaries to innovate beyond standard procedures. Convert failing silicon into actionable root cause by integrating test and characterization data, DFT-enabled observability, volume scan diagnosis, and targeted physical analysis (such as emission microscopy). Leverage ATPG-generated test vectors and scan diagnostics to systematically isolate failure mechanisms. Bridge design, test, and manufacturing to rapidly enable corrective action across yield, quality, and product development.


• VLSI & Silicon Debug: Perform deep-dive analysis on VLSI designs to understand digital circuitry behavior, timing interactions, and failure modes. Apply silicon debug techniques to correlate electrical characterization with design netlist and layout, supporting both design verification and production silicon analysis. Demonstrate an ability to think outside the box when standard diagnostic paths are exhausted.


• Cross-functional Collaboration: Act as a key technical bridge through proactive collaboration across the organization. Work closely with Design teams on verification, Test engineers on diagnostic accuracy, and Physical FA specialists to correlate electrical failures with physical defects. Liaise with business units' product engineers and fab process engineers to improve yield based on Digital FA findings. Interface with EDA tool experts and design automation teams to optimize DFT coverage and diagnostics.


• Product Engineering: A small portion of the role (10-20%) will entail product ownership where you will conduct thorough analysis of production yield issues to identify root causes, implement corrective actions, and collaborate with Business Units to characterize, qualify, and successfully release new products to production.

Minimum Requirements:

• Bachelor’s degree in Computer Engineering, Electrical Engineering, Physics, or related degree
• 5 years of experience in the semiconductor industry 

Preferred Qualifications:

• Experience in DFT and ATPG for SoC or ASIC designs
• Experience utilizing industry-standard DFT/ATPG EDA tools
• Familiarity with VLSI 
• A solid grasp of digital design fundamentals
• Strong analytical and problem-solving skills
• Self-motivated, high-energy, individual
• Excellent written and spoken communication skills 
• Proven ability to drive results, prioritize tasks, and manage time to meet project deadlines