Director, Process Engineering

FormFactor is launching a large‑scale, high‑impact startup operation in Farmers Branch—an exciting opportunity to help build, define, and lead a cutting‑edge manufacturing environment from the ground up. As part of a collaborative and people‑centered culture, you will shape both the technology and the team that powers our next phase of growth. 

The Director of Process Engineering is responsible for leading all process development, optimization, and sustaining engineering activities across a vertically integrated probe card manufacturing operation. This role oversees engineering teams supporting semiconductor‑style fab processes, probe stitching, and SMT‑based vertical probe card assembly, ensuring world‑class manufacturing capability, operational efficiency, and product performance. The Director will drive continuous improvement, yield enhancement, equipment strategy, and technology roadmap execution to support customer requirements and business growth. 

KEY RESPONSIBILITIES:

1. Leadership & Strategy 

• Lead and develop a high‑performing Process Engineering organization covering fab processes, probe assembly, SMT operations, and new product introduction (NPI). 

• Define the long‑term process technology roadmap aligned with R&D, Operations, and Quality. 

• Drive talent development through individualized growth plans, skill-building, cross-training and succession planning. 

• Establish engineering performance metrics (yield, Cp/Cpk, cycle time, OEE, defectivity) and drive continuous improvement. 

• Partner with Manufacturing Operations to jointly own output, yield, and cost targets. 

2. Semiconductor‑Style Fab Process Ownership 

• Oversee processes such as thin‑film deposition, lithography, etch, metallization, planarization, cleaning, and metrology. 

• Ensure robust process controls (SPC, DOE, FMEA) and maintain high‑yield, stable wafer‑type production flows. 

• Lead qualification and integration of new fab equipment, chemistries, materials, and automation. 

3. Probe Stitching & Micro‑Assembly 

• Own all processes related to laser cutting, probe stitching, alignment, and mechanical integration. 

• Develop breakthrough process capabilities to improve probe coplanarity, electrical performance, and mechanical reliability. 

4. SMT & Vertical Probe Card Manufacturing 

• Oversee SMT assembly processes, including solder paste deposition, component placement, reflow, AOI, underfill, etc. 

• Develop and optimize assembly flows for vertical probe cards, integrating substrates, MEMS structures, interposers, connectors, and mechanical fixtures. 

• Ensure DFM standards and process scalability for new card architectures. 

5. Continuous Improvement & Operational Excellence 

• Lead root‑cause analysis for yield excursions, field returns, and reliability failures. 

• Implement structured problem‑solving frameworks (8D, 4C). 

• Drive automation, SPC dashboards, digital manufacturing systems, and advanced analytics into process control. 

6. Cross‑Functional Collaboration 

• Partner with R&D to industrialize new probe card technologies, ensuring manufacturability and cost competitiveness. 

• Work with Supply Chain on material qualification, vendor capability, and risk mitigation. 

• Collaborate with Quality Engineering to ensure compliance with industry standards and customer specifications. 

7. Compliance, Safety & Documentation 

• Ensure all processes meet EHS, chemical handling, and equipment safety requirements. 

• Maintain robust documentation for processes, change control, FMEA, control plans, and work instructions. 

• Lead process audits and customer technical reviews. 

 PREFERRED EXPERIENCES & QUALIFICATIONS:

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, Chemical, or related). 

• 10+ years of experience in semiconductor manufacturing, probe card manufacturing, advanced packaging, MEMS, or similar high‑precision industries. 

• Proven leadership experience managing engineering or technical teams. 

• Deep expertise in process engineering, statistical analysis, and advanced problem‑solving. 

• Experience in probe card manufacturing, MEMS probe technologies, or advanced micro‑assembly. 

• Familiarity with SMT, micro‑joining, precision alignment technologies, and optical metrology. 

• Understanding of reliability testing, thermal‑mechanical modeling, and electrical test correlation. 

• Experience with factory automation, MES systems, and digital twins 

• Strong technical depth combined with practical manufacturing intuition. 

• Excellent communication and ability to influence at both engineering and executive levels. 

• Strategic thinker with hands‑on capability to troubleshoot the most complex process challenges. 

• Passion for team development, innovation, and continuous improvement. 

Farmers Branch, TX

Benefits offered for this role include medical, dental, vision, EAP, short-term and long-term disability, life insurance, flexible spending and savings accounts, 401(k), ESPP and paid time off.