Dry Film Lamination Engineer

Job/Position Summary

The Dry Film Lamination Engineer is hands-on, focusing on developing,  optimizing, and supporting dry film lamination and patterning processes using Ajinomoto Build-up Film (ABF) and Dry Film Resist (DFR). This role is ideal for an engineer who enjoys working close to the process, running experiments, troubleshooting defects, and collaborating across multiple integration modules.

Primary Responsibilities

• Develop and optimize ABF and DFR lamination processes for advanced packaging applications.


• Run experiments to improve lamination quality, adhesion, and yield.


• Support DFR exposure and development processes and chemistry control.


• Troubleshoot adhesion loss, voiding, wrinkling, delamination, warpage, and defectivity.


• Develop and maintain ABF/DFR adhesion to glass and copper surfaces.


• Support ABF laser structuring and via formation processes.


• Set up, qualify, and maintain ABF/DFR lamination and exposure equipment.


• Work closely with integration, laser, plating, and reliability teams.


• Collect and analyze process data; apply DOE and root cause analysis to drive improvements.


• Support scale-up from R&D to pilot and early manufacturing environments.


• Perform additional functions and other duties as assigned or required.
  

Requirements

• Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, or related field required.


• 2-5 years of experience in copper plating or advanced packaging process engineering.
  


• Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently. 
  

• This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

Knowledge, Skills, and Abilities

• Hands-on experience with Dry Film Resist (DFR) lamination and processing.


• Comfortable working in a startup or development-focused environment.


• Experience with Ajinomoto Build-up Film (ABF) or similar build-up dielectric films.


• Understanding of ABF/DFR adhesion mechanisms on copper and/or glass.


• Experience working with glass substrates and/or organic laminates.


• Familiarity with lamination equipment (vacuum laminators, hot roll laminators, press systems).


• Knowledge of DFR development processes and chemistries.


• Ability to work independently while collaborating across teams.


• Strong hands-on experimental skills and data-driven problem-solving approach.


• Understanding of surface preparation and cleaning for lamination processes.


• Experience with laser drilling or laser via formation in ABF is desired.


• Experience scaling lamination processes from R&D to pilot or production is desired.


• Knowledge of SPC, FMEA, and yield improvement methodologies is desired.


• Familiarity with copper plating and integration with RDL processes is desired.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable)


• Prolonged periods of sitting or standing

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.


• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.


• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.