HVM Field Process Engineer PEALD, PECVD

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

As a Field Process Engineer supporting PEALD Plasma-enhanced Atomic Layer Deposition (PEALD) and Plasma-enhanced Chemical Vapor Deposition (PECVD) on ASM’s XP8 DCM/QCM platforms, you will act as the on‑site process expert at customer HVM fabs. You will optimize deposition processes, resolve technical issues, and ensure tool performance meets customer and ASM requirements. This role is ideal for engineers who enjoy hands‑on problem‑solving, fast‑paced environments, and contributing to next‑generation semiconductor manufacturing.

Key Responsibilities

• Lead process qualification and optimization during tool installs and ramp‑up.


• Execute structured DOEs to improve film quality, uniformity, and throughput.


• Troubleshoot process issues using systematic root‑cause analysis.


• Partner with customer and ASM teams to drive continuous improvement and tool‑to‑tool matching.


• Document findings and share learnings across global teams.

Customer Engagement

• Build strong, trust‑based technical relationships with customer engineers.


• Anticipate needs and provide sustainable, long‑term solutions.


• Support escalations with clear communication and action plans.


• Represent ASM with professionalism and technical credibility.

What Makes You Successful

• Clear communication, strong troubleshooting methodology, and ability to stay composed under pressure.


• Highly collaborative, organized, and proactive in solving issues and driving improvements.


• Adaptable to changing priorities in a high‑volume manufacturing environment.

Qualifications

• Master’s or PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related fields.


• Experience with deposition processes (PEALD/PECVD), vacuum systems, metrology, and semiconductor manufacturing—preferably HVM and ASM tools.


• Strong DOE and experimental analysis skills.


• Ability to travel up to 25%; escalations may require extended hours/weekends.


• Strong understanding of IP boundaries and confidentiality requirements