Manufacturing Integration Engineer

Qualifications 

• Master’s or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field. 

• Proven experience in semiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunction, or related structures). 

• Experience with post wafer fab operations such as Back-Grind/Back Metallization, Packaging, Dicing and Singulation, module construction. 

• Experience with wafer level testing, ILT/WAT/PCM and Probe.  Familiarity with package level Final Testing especially for discrete power devices 

• Experience taking technologies from development stage, through optimization and qualification and into volume ramp. 

• Strong understanding of semiconductor physics, device reliability, and fabrication processes, including experience in 300mm fabrication. 

• Demonstrated ability to translate high‑level objectives into actionable engineering plans and drive projects independently. 

• Strong data‑driven problem‑solving skills using DOE, statistical analysis, SPC, 6‑sigma, and FMEA methodologies. 

• Track record of leading or significantly contributing to technology development projects with measurable impact on performance, reliability, yield, or cost. 

• Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences. 

• Ability to manage multiple projects simultaneously in a fast‑paced development environment 

 Salary: onsemi is excited to share the base salary range for this position is $127,800 to $217,200, exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf