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Founded in 1991, Silicon Microstructures, Inc. is a world leader in the design and manufacture of Micro Electro-Mechanical Systems (“MEMS”) that lie at the heart of the advanced sensing market, enabling devices in the medical, industrial, digital consumer, security, and automotive sectors.
The company has established itself as a premier provider of MEMS-based pressure sensors for a range of markets, supplying advanced high and low-pressure sensor products that meet the stringent requirements for medical, industry and consumer safety. Silicon Microstructures’ design, production and quality control processes have enabled it to develop both the smallest and smartest pressure sensors available today. SMI offers a wide range of pressure sensors, including uncompensated sensors, temperature compensated and calibrated products as well as sensors systems consisting of an ASIC paired with a sensor die in a custom package.
The Back End Process Engineer will drive yield improvements and implement more automation in the back end manufacturing processes at SMI. The responsibilities include sustaining and improvement of wafer probing, wafer dicing, automated optical inspection (AOI), wafer mapping, and automated die pick and place processes.
The engineer will work in collaboration with the production and R&D team to develop high yielding products with great deal of attention to develop processes optimized for automation and manufacturability. The engineer will play an active role in quality improvement in the framework of SMI’s IATF16949 quality management system.
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