Job Description - New College Grad - Memory Design Engineer, HBM
Build, layout, and optimize Memory, Logic, and Analog circuits. Perform parasitic modeling, build validation, reticle experiments, and tape-out revisions. Coordinate layout processes, including floor-planning, placement, and routing. Conduct verification activities using industry-standard modeling and simulation tools. Collaborate with multi-functional teams—including Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering—to ensure manufacturability and product success. Coordinate with Standards, CAD, modeling, and verification groups to drive build quality and consistency. Complete chip-level layout development, circuit checking, specification documentation, and evaluation of semiconductor devices and components. Bachelor's degree or Master's degree or equivalent experience in Electrical Engineering, Computer Engineering, or a related field. Experience in crafting and analyzing digital, analog, or mixed-signal circuits. Proficiency in parasitic modeling, verification, and simulation using industry-standard EDA tools. Proficient in layout procedures including floor-planning, placement, and routing. Ability to interpret product requirements, logic diagrams, and device specifications. Experience in supporting semiconductor build activities, including circuit checking, device evaluation, and documentation. Proven experience in multi-functional engineering efforts spanning build, verification, product engineering, test, assembly, probe, or process integration. Hands-on experience in reticle experiments or tape-out revision cycles. Experience collaborating with CAD, modeling, and standards teams to improve building methodologies.
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