SiC Wafer and Package Technology Development Engineer

Technical and customer support for the qualification of SiC die sales and development

SiC wafer die sales is a main focus for onsemi and is critical to its future.  This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi.

• Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals


• Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams


• Understand detailed customer requirements and verify latest technologies meet or exceed all expectations


• Document findings and process flows to create baseline for new technology platforms


• Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.

• Strong communication skills


• Ability to lead development projects and implement strategies on a global basis


• Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding


• Knowledge of materials and material interactions