Engineer, Senior (Technology Integration - Wafer-level Packaging)

## \nCompany:\n\nRF360 Singapore Pte., Ltd.\n\n## Job Area:\n\nEngineering Group, Engineering Group \u003e Hardware Engineering\n\nGeneral Summary:\n\nJob Scope\n\n\u2022 Responsible for end\u2011to\u2011end development, qualification, and mass\u2011production transfer of new processes, materials, and manufacturing technologies.\n\n\u2022 Ensure process readiness, robust manufacturability, and smooth ramp\u2011up through strong cross\u2011functional coordination, data\u2011driven decision\u2011making, and technology leadership.\n\n\u2022 Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.\n\n\u2022 Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.\n\n\u2022 Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.\n\n\u2022 Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment.\n\nJob Responsibilities\n\nTechnology Development\n\n\u2022 Lead development of new processes, modules, or integration flows from concept to qualification and manufacturing release.\n\n\u2022 Define process requirements, success criteria, design\u2011of\u2011experiments (DOE), and characterization plans.\n\n\u2022 Drive root\u2011cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.\n\n\u2022 Translate product requirements into process specifications and control strategies. Technology Transfer \u0026 Ramp\n\n\u2022 Co-own the technology transfer roadmap with project leader - from pilot line to high\u2011volume manufacturing. Adapts to shifting priorities and resources while ensuring deadlines are met.\n\n\u2022 Supervise and provide technical guidance to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.\n\n\u2022 Work with each process cluster to establish critical process windows, statistical control limits, and ramp\u2011readiness criteria.\n\n\u2022 Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.\n\nEducation/ Experience Requirements\n\nBachelor\u2019s or Master\u2019s degree in Engineering (Materials, Chemical, Semiconductor, etc.).\n\n\u2022 3+ years of experience in process integration engineering, technology development, or a high volume manufacturing fab.\n\n\u2022 Broad exposure to wafer-level packaging technology and processes.\n\n\u2022 Demonstrated success leading cross disciplinary technology integration projects.\n\n\u2022 Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.\n\n\u2022 Excellent communication, technical documentation, and stakeholder management skills.\n\nSkills, Abilities \u0026 Knowledge\n\nResourceful with critical thinking in problem solving.\n\n\u2022 Project and priority management skills.\n\n\u2022 Experience in semiconductor, MEMS, packaging, or high\u2011volume manufacturing.\n\n\u2022 Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc.\n\n\u2022 Experience with scale-up from R\u0026D \u2192 Pilot \u2192 HVM.\n\n\u2022 Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC).\n\n\u2022 Able to multi-task, set priorities and meet critical deadlines. Maintain open communication.\n\n\u2022 Able attend training program overseas at sister\u2019s fab for up to 1 year.\n\nMinimum Qualifications:\n\n\u2022 Bachelor\u0027s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. \nOR \nMaster\u0027s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. \nOR \nPhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.\n\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm\u0027s toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\n\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\n\nTo all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\n\nIf you would like more information about this role, please contact Qualcomm Careers.\n