Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

Define technical strategy and lead multi-functional projects in structural and electric film development. Architect solutions and promote innovative technologies across teams. Influence technical standards and drive process improvements. Lead advanced process development, fixing, and integration. Mentor engineers and foster technical growth. Integrate unit processes into full module packages and validate within and cross-module interactions, device/process linkages via wafer-level electricals. Drive complex problem solving across process/structure/hardware/device interactions—root cause analysis, FMEA, SPC, and corrective actions that recover window with no yield trade-off. Utilize advanced characterization (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance; derive correlation models that predict reliability and scaling behavior. Lead multi-functional teams and vendor engagements to push hardware/process capability, set achievements, and secure resources. Advanced proficiency in thin film processing (Plasma Enhanced CVD, Thermal CVD, ALD). Hands-on experience with structural and electric film hardware and equipment optimization (dielectric and carbon based films). Hardware optimization: Precursor delivery & temperature control, chamber matching/segregation, batch vs single wafer trade-offs, metrology hooks. Strong understanding of process-mechanical-device interactions, reliability modeling, and 3D NAND scaling. Skilled in advanced characterization techniques (SIMS, XPS, TEM, electrical stress testing) and correlating process parameters to structural and device performance. Proven ability to lead technical problem-solving and support engineers developing their skills. PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related field. 15 to 20 years of experience in Thin Film research and development for NAND process specifically plasma and thermal CVD for dielectric (including highK and lowK) and carbon-based depositions. Demonstrated leadership in multi-functional development and vendor collaboration.