Your next opportunity: Mixed-Signal ASIC Lead in Sydney

Salary :

$140,000 - 180,000 yearly

Company : Onset

Job Type : Full Time

Sydney, Australia

Job Description - Your next opportunity: Mixed-Signal ASIC Lead in Sydney

Job Description

Mixed-Signal ASIC Lead

(Full Australian working rights required)
$140-180k + super + equity

Take diamond-based quantum sensing into its first product ASIC:

An early-stage deep tech company is turning diamond-based quantum sensing into compact devices for real-world deployment

The research chip exists, and its limitations have been investigated

Customer demand is bringing the next chip’s development forward alongside field trials

You’ll join as the first dedicated chip specialist, owning the external design partnership and helping deliver the first product ASIC

The opportunity goes beyond a smaller sensor:

Integrating diamond-based sensing with custom silicon creates more ways to embed magnetic measurement into equipment

Smaller devices can be deployed in arrays and networks, measuring changes across a wider area

Applications include navigation where GPS is unavailable and detecting magnetic anomalies across distributed sensors

Your engineering decisions will help determine how that capability becomes a practical commercial product

You’ll own a close technical partnership:

Become the primary technical contact for an external chip design team that works as an extension of the business

Build on an established, positive relationship, setting requirements and challenging assumptions with evidence

Report to the Product and Engineering Lead and work closely with hardware and firmware engineers

Connect design decisions to product requirements and partner needs

Your remit runs from specification to measured silicon:

Define CMOS requirements and manage outsourced design and characterisation through to tape-out

Review simulations against specifications and bring up first silicon, including packaged parts and bare die

Characterise noise, linearity, bandwidth, power and photosensor performance across temperature and supply conditions

Correlate measurements with simulation, automate repeatable tests and feed findings into the next design

Develop test interfaces, including package/PCB layout, needle probing and probe cards

Support ASIC integration, FPGA controller programming and migration of FPGA functions into future CMOS/SoC designs

Success means taking ownership, then shaping what comes next:

First six months: Understand the current chip in depth and take responsibility for the design-partner relationship

As the programme approaches tape-out: Use your understanding of target markets and partner needs to guide future chip and peripheral improvements

Throughout: Give the wider team clear technical recommendations grounded in measured performance

You’ll bring experience you can explain at the bench:

Around five to ten years in mixed-signal ASIC design, including photosensor design or validation

Experience taking a chip from specification to measured silicon, with a clear account of your contribution.

Confidence investigating differences between simulation and bench results.

The judgement to challenge a design partner and explain trade-offs to colleagues across disciplines.

A willingness to get into the lab and work through the problem yourself.

The team and the practicalities:

A small, collaborative engineering team where your specialist judgement will be visible and relied upon

Hands-on lab work, with flexibility

Full Australian working rights required

Interested?

Apply direct for a confidential conversation. We’d like to hear about a chip you’ve worked on, what the silicon taught you, and what you’d like to own next.

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Your next opportunity: Mixed-Signal ASIC Lead in Sydney

Job Description - Your next opportunity: Mixed-Signal ASIC Lead in Sydney

Job Description

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