Senior Process Engineer (Advanced Packaging)

As a Senior Process Engineer in our Corporate Research & Development team, you’ll shape the future of atomic layer deposition (ALD) innovation. By combining your technical know-how with a collaborative mindset, you’ll drive new process development from concept through integration, working on technologies that power tomorrow’s logic, memory, and advanced packaging solutions. Your creativity, hands-on experimentation, and clear communication will bring ideas to life—delivering value across teams and customers.

What you will be working on

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  Develop new deposition processes and integration flows for logic, memory, packaging, analog, and power applications.

  
  


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  Design and execute experiments; analyze complex data to draw actionable conclusions.

  
  


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  Work hands-on with advanced semiconductor tools, optimizing processes and equipment synergy.

  
  


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  Collaborate with internal and customer R&D teams to define requirements and successfully deliver project outcomes.

  
  


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  Support product transfers and demonstrations across sites, including knowledge sharing and occasional travel.

  
  

What we are looking for

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  PhD in physics, chemistry, chemical engineering, or materials science, ideally with a thesis linked to semiconductors or thin film technologies. Alternatively, a Master’s degree with several years of relevant industry experience is welcome.

  
  


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  Solid foundation in semiconductor device physics, process integration, and cleanroom practices.

  
  


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  Proven expertise in thin film deposition techniques such as Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD).

  
  


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  Skilled in material and process characterization tools including XPS, AFM, XRD, TEM, ellipsometry, and electrical testing methods.

  
  


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  Experience in designing, conducting, and interpreting complex experiments using scientific and statistical methods.

  
  


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  Ability to work hands-on with advanced semiconductor R&D tools and equipment.

  
  


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  Strong project management skills: capable of taking projects from concept to completion while engaging with cross-functional stakeholders.

  
  


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  A proactive communicator who thrives in multidisciplinary, collaborative environments.

  
  

What sets you apart

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  Specialized knowledge of 3D integration and advanced packaging concepts such as wafer-to-wafer (W2W) and die-to-wafer (D2W) hybrid bonding, memory-on-memory, logic-on-memory, imager stacking, and low-temperature device architectures.

  
  


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  Familiarity with advanced packaging characterization methods such as CSAM, WCA, Maszara test, and 3-point bending.

  
  


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  Practical cleanroom experience using lithography, solvent-based wet etch, dry etch, and PVD deposition techniques.

  
  


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  Exposure to process development projects that required close interaction between hardware and chemistry optimization.

  
  


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  A systems-level thinker with the ability to understand how process innovations impact full integration flows and device performance.

  
  


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  Curious and driven by impact: someone who stays on top of scientific trends, explores new ideas with an open mind, and balances creativity with practical execution.

  
  


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  Adaptable and growth-oriented, with the motivation to develop both technically and personally in a fast-paced environment.