Microelectrode arrays (MEAs) are widely used for in vitro and in vivo monitoring of neural and cellular activity. Conventional MEAs rely on electrical sensing to record extracellular potentials, offering high temporal resolution but limited spatial information and sensitivity to electrode impedance, noise, and drift. In recent years, hybrid MEA platforms integrating optical and electrical sensing have emerged, enabling complementary readouts such as electrical spikes, optical signals from voltage- or calcium-sensitive indicators, and local biochemical or optoelectronic responses.
The integration of optical and electrical sensing in a single MEA introduces new challenges in device characterization, including signal crosstalk, noise coupling, spatial resolution mismatch, and calibration consistency across modalities. Systematic characterization is essential for validating performance, understanding limitations, and guiding future device optimization.
This internship aims to perform a comprehensive characterization of a hybrid optical-electrical MEA array ASIC, starting from the ASIC package, PCB design, to the final test platform for future in-vitro experiments.
Required skills:
• Good understanding of analog and digital circuit design concepts.
• Good knowledge of PCB design using Altium Designer.
• Experience in test and measurement of electronic circuits.
• Good knowledge of data analysis using MATLAB or Python.
• Strong problem-solving skills.
• Eagerness to learn and innovate.
• Good communication skills.
Required background: Major in electrical engineering or related.
Type of work: 30% ASIC package and PCB design, 30% test setup, 40% Measurement & data analysis (ASIC characterization)
Type of internship: Master internship, PhD internship
Duration: 3-6 months
Required educational background: Electrotechnics/Electrical Engineering
University promotor: Chris Van Hoof (KU Leuven)
Supervising scientist(s): For further information or for application, please contact Xiaolin Yang ([email protected])
The reference code for this position is 2026-INT-070. Mention this reference code in your application.
Imec allowance will be provided.
Applications should include the following information:
Incomplete applications will not be considered.
The integration of optical and electrical sensing in a single MEA introduces new challenges in device characterization, including signal crosstalk, noise coupling, spatial resolution mismatch, and calibration consistency across modalities. Systematic characterization is essential for validating performance, understanding limitations, and guiding future device optimization.
This internship aims to perform a comprehensive characterization of a hybrid optical-electrical MEA array ASIC, starting from the ASIC package, PCB design, to the final test platform for future in-vitro experiments.
Required skills:
• Good understanding of analog and digital circuit design concepts.
• Good knowledge of PCB design using Altium Designer.
• Experience in test and measurement of electronic circuits.
• Good knowledge of data analysis using MATLAB or Python.
• Strong problem-solving skills.
• Eagerness to learn and innovate.
• Good communication skills.
Required background: Major in electrical engineering or related.
Type of work: 30% ASIC package and PCB design, 30% test setup, 40% Measurement & data analysis (ASIC characterization)
Type of internship: Master internship, PhD internship
Duration: 3-6 months
Required educational background: Electrotechnics/Electrical Engineering
University promotor: Chris Van Hoof (KU Leuven)
Supervising scientist(s): For further information or for application, please contact Xiaolin Yang ([email protected])
The reference code for this position is 2026-INT-070. Mention this reference code in your application.
Imec allowance will be provided.
Applications should include the following information:
- resume
- motivation
- current study
Incomplete applications will not be considered.
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