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Internshiptopic: Development of a Novel Dry-Film Resist Process for Wafer-to-WaferBonding
Dailysupervisor: Clement Leruth ( < email deleted for security reasons >)
Internshipintroduction
Microfluidics hasbecome a cornerstone technology for modern biomedical, chemical, andenvironmental applications. This technique has been enabling precise control offluids at the microscale with reduced sample volumes and faster analysis times.The performance and reliability of microfluidic devices strongly depend on thequality of their fabrication, which remains a major technical challenge.
Achievinghigh-resolution patterns, reproducibility, and robust sealing is particularlydifficult as device architectures become more complex. Fabrication constraintsoften limit scalability, material compatibility, and integration of newfunctionalities. To address these challenges, we open this internship todevelop a process using a novel dry film resist for microfluidic applications.This work will focus both on improving developing a recipe for this novel resistand optimise the development for wafer-to-wafer bonding. This internship offersyou an unique opportunity to work in a team centered on lab scaled developmentof diverse devices on micro scale.
Techniques to belearned: Microfabrication, lamination, photolithography, wafer to waferbonding.
Type of project:Master internship
Duration: 3 months
Location: Imec 1 Heverlee
Type of internship: Master internship
Duration: 3 months
Required educational background: Chemistry/Chemical Engineering, Nanoscience & Nanotechnology, Materials Engineering, Bioscience Engineering, Biomedical engineering, Physics
Supervising scientist(s): For further information or for application, please contact Alexey Podkovskiy (< email deleted for security reasons >) and Clement Leruth (< email deleted for security reasons >) and Ben Jones (< email deleted for security reasons >)
The reference code for this position is 2026-INT-012. Mention this reference code in your application.
Only for self-supporting students.
Applications should include the following information:
Incomplete applications will not be considered.
Dailysupervisor: Clement Leruth ( < email deleted for security reasons >)
Internshipintroduction
Microfluidics hasbecome a cornerstone technology for modern biomedical, chemical, andenvironmental applications. This technique has been enabling precise control offluids at the microscale with reduced sample volumes and faster analysis times.The performance and reliability of microfluidic devices strongly depend on thequality of their fabrication, which remains a major technical challenge.
Achievinghigh-resolution patterns, reproducibility, and robust sealing is particularlydifficult as device architectures become more complex. Fabrication constraintsoften limit scalability, material compatibility, and integration of newfunctionalities. To address these challenges, we open this internship todevelop a process using a novel dry film resist for microfluidic applications.This work will focus both on improving developing a recipe for this novel resistand optimise the development for wafer-to-wafer bonding. This internship offersyou an unique opportunity to work in a team centered on lab scaled developmentof diverse devices on micro scale.
Techniques to belearned: Microfabrication, lamination, photolithography, wafer to waferbonding.
Type of project:Master internship
Duration: 3 months
Location: Imec 1 Heverlee
Type of internship: Master internship
Duration: 3 months
Required educational background: Chemistry/Chemical Engineering, Nanoscience & Nanotechnology, Materials Engineering, Bioscience Engineering, Biomedical engineering, Physics
Supervising scientist(s): For further information or for application, please contact Alexey Podkovskiy (< email deleted for security reasons >) and Clement Leruth (< email deleted for security reasons >) and Ben Jones (< email deleted for security reasons >)
The reference code for this position is 2026-INT-012. Mention this reference code in your application.
Only for self-supporting students.
Applications should include the following information:
- resume
- motivation
- current study
Incomplete applications will not be considered.
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