Your role at C12 Quantum Electronics:
We are seeking a 3D Integration Engineer to develop advanced packaging and heterogeneous-integration technologies for scalable quantum-computing hardware.
You will design and optimize interconnects between quantum devices, control electronics, photonic components, and cryogenic systems while maintaining signal integrity, thermal performance and reliability.
- You will develop 2.5D and 3D integration architectures for quantum processors and supporting electronics.
- You will design interposers, through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces.
- You will integrate our QPU with other chip modality with cryogenic CMOS, RF/microwave circuitry, photonics, MEMS, and packaging substrates.
- You will perform electrical, electromagnetic, mechanical, and thermal simulations.
- You will define fabrication flows and design rules with foundries, packaging partners, and internal process teams.
- You will develop test vehicles and perform experimental measurements on those fabricated devices, analyze experimental data to improve yield and performance.
- You will document designs, process specifications, qualification results, and technology roadmaps.
- You will collaborate with quantum-device, circuit-design, cryogenic, materials, manufacturing, and systems teams.
About you:
- You have a Bachelor’s or Master’s degree in electrical engineering, materials science, mechanical engineering, applied physics, or a related discipline.
- You have experience in semiconductor packaging, wafer-level integration, MEMS, microfabrication, or heterogeneous integration.
- You are familiar with one or more relevant processes: wafer bonding, hybrid bonding, TSVs, flip-chip assembly, thin-film deposition, lithography, etching, electroplating, or CMP.
- You are familiar with package-level electrical, thermal, and mechanical design.
- You have experience with CAD, electromagnetic simulation tools, multiphysics simulation, statistical analysis, or semiconductor process-development tools.
- You have strong experimental, troubleshooting, documentation, and cross-functional communication skills.
- PhD or equivalent industry experience in advanced packaging or semiconductor integration.
- Experience with superconducting, semiconductor-spin, trapped-ion, neutral-atom, or photonic quantum-computing platforms.
- Experience with RF/microwave interconnects, photonic coupling, or high-density chiplet systems.
- Experience transferring a packaging or integration process from research into pilot or volume manufacturing.
What we offer:
- 60,000 euros - 78,000 euros yearly base salary
- Stock options for every employee (BSPCE/ESOP)
- Sponsored trip to conferences around the world
- A highly dynamic international team
- Swile meal vouchers
- Mental health support with moka.care
- Training budget/ Annual Learning & Development Allowance
- Sabbatical leave (after 2 years in the company)
- Vibrant office culture (two office spaces in the heart of Paris, team lunches, offsite events, Friday breakfasts..)
You should join us if...
- You want to have a key role in a growing startup with challenges at the frontier of the technology.
- You want to contribute to achieving landmark results in quantum computing, making a difference in the emerging quantum technologies.
- You want to work within a 60-people team with various backgrounds in nanofabrication, quantum electronics, and carbon nanotube science to create a revolutionary quantum computing processor.
- You want to thrive in an exceptional scientific environment with several industrial and academic partners.
- You share our values (excellence, scientific integrity, diversity, curiosity, and care) and want to help us define our product-focused culture and ambition to accelerate.