Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging

Unternehmen : Menlo Systems Gmbh

Auftragstyp : Vollzeit

Martinsried

Anzahl der Bewerber

000+

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Arbeitsbeschreibung - Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging

Prototype thermal, electrical, and optical packaging solutions for chips
Develop the infrastructure and processes for the testing and packaging of optical chips at Menlo Systems
Work as part of a team on the realization of PIC-based light sources, such as frequency combs and supercontinua

Completed university degree in the field of optical engineering, electrical engineering or physics
First professional experience as a development engineer for PIC, either in an industrial environment or equivalent experience, e.g., in the framework of a PhD
Knowledge and experience in at least two of the following areas: photonic integrated circuitry, packaging, electronics, mechanical design, laser physics, photonics
Communication and teamwork skills with a high degree of initiative and persuasiveness
Good knowledge of written and spoken German and English

Exciting and challenging tasks in a growing market
A highly motivated team, with creative freedom
Flexible working hours and 30 days of vacation
Individual and practice-oriented training
Opportunities for professional development
Easily-reached location by public transport and by car
A subsidy for public transport, alternatively bicycle leasing or a free parking space

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Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging

Arbeitsbeschreibung - Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging

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