Field Service Engineer (all genders)

Provide quality on-site repair, maintenance service, and complete installation/relocation start-up services of Lam's complex electro-mechanical and electronic systems at customer sites. Perform analytical problem-solving, troubleshooting, conduct diagnostics, isolate issues to the component level, and take corrective actions or request assistance to minimize downtime, system interruptions, and equipment malfunctions. Keep up to date on semiconductor capital equipment and Lam products through learning, training, and certification. Maintain records and reports to coordinate activities between Lam and the customer. Serve as a subject matter expert, representing Lam to our valued customers, delivering exceptional customer satisfaction. Transparently discuss opportunities and challenges with customer to increase trust. Update customer on status of Lam tools as needed. Technical Degree/Diploma/Bachelor's degree in Microelectronics, Mechanical Engineering, Mechatronics, Electrical Engineering or related technical field with 2+ years of experience; or an advanced degree without experience. Proficiency in interpreting electrical and mechanical schematics, diagrams, and operation manuals. Able to work in a clean room environment while wearing personal protective safety equipment, or cleanroom suit. Frequently position oneself (e.g., bend, stoop, reach, walk, sit, twist, squat, kneel, climb, stand) to perform job tasks for extended periods. Able to travel frequently, domestically, Europe wide and internationally, based on customer needs, flexibility to work a variety shifts including compressed and alternative workweeks including overtime and on-call if needed. Due to work assignments in various European Union countries, EU passport is required. Proficiency in basic computer skills and familiarity with common office software including Microsoft Office Suite. Experience in installation, maintenance, repair and troubleshooting of semiconductor capital equipment, either in ETCH, Thin-Film Deposition or Wafer cleaning area is a plus. Communication skills, both written and verbal, in English. Basic communication skills in German language. Foundational analytical and problem-solving skills.