Inline Metrology Discovery Lead (f/m/d)

Our technology is state of the art in lab environments today, with units installed in Taiwan, the United States and Europe. We have demonstrated the capability of quantum sensing on HBM4 stacks and on the most recent CoWoS structures, providing technical guidance where established methods reached their limits. Now we are bringing that capability into the fab, at wafer level and in high-volume manufacturing environments. The first inline use cases are identified, and more are coming.  

As Inline Metrology Discovery Lead, you will work directly with leading foundries, IDMs and OSATs to find additional cases where magnetic field imaging solves a yield problem that no existing inspection method can, both pre-bonding and post-bonding. You turn the existing broad customer interest into precise, testable problem statements, secure the samples and defect context needed to prove or disprove fit, and rank the opportunities so that our engineering effort goes to the use cases that matter.  

This is a technically grounded, decision-owning role at the front end of our inline product strategy, reporting to our Head of Pre-Development. You lead a small multidisciplinary team from day one, application engineers, data scientists and lab technicians, and you grow it into the inline applications organisation as the product matures. You do not need to arrive as a quantum sensing expert. You need to know high-volume manufacturing and inspection or metrology tooling deeply, you know how to get the best from a mixed team of engineers and scientists, and you want to be the person who decides what this technology becomes in the fab. 

Founded in 2022 as a spin-off of TU Munich, QD leverages quantum sensors to rapidly capture three-dimensional current maps within multi-layer chips. Our strong, international team of over 70, including physicists, engineers, data scientists, and other experts, works side by side with major semiconductor manufacturers, supporting chip debugging and accelerating yield analysis. Backed by top-tier deep tech investors, semiconductor experts, and strategic public programmes, we have ensured long-term stability, shifting from breakthrough to scale – and shaping the next chapter in chip testing.

• 10+ years in semiconductor high-volume manufacturing, process control, inline inspection or metrology, with substantial time in or adjacent to production, including wafer-level inspection steps 
• Direct experience of how inspection and metrology tools get qualified and adopted in HVM: sampling plans, cost of ownership, integration constraints, and who actually signs off 
• A network at foundries, IDMs or OSATs that reaches the working engineering level, not only management 
• A track record of defining use cases for a new inspection or metrology capability and driving them to clear technical decisions, including the judgement to call an early No-go and make it stick with customers and internal teams 
• Strong grounding in the defect physics of advanced packaging and back-end-of-line (opens, shorts, voids, bonding defects), and an honest view of where incumbent methods fail 
• Comfortable in an international environment across Europe, the US and Asia with substantial travel; fluent in English, German is an advantage

To be explicit about scope: this is not a quota-carrying sales role, not a partnership management role, and not a standard applications engineering role. It is a technically grounded, decision-owning position at the front end of our inline product strategy.