Microelectronic System and Packaging Mold Flow Simulation Engineer

onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Germany.  As a microelectronic system and packaging mold flow simulation engineer, you will have the opportunities to support new power module and system development and new product design, assembly and process, quality and reliability, and customers in worldwide.

Performance Objectives:

The successful candidate will have the opportunity to:

• Mold flow simulation for thermal setting and thermoplastic in both transfer and injection molding.
• Do thermal-mech simulation for microelectronic packaging and system, assembly process.
• Analyze the voids, air tracks and NO filling defects in mold flow.
• Analyze the Degree of Curing and its impact to mold material property and performance. 
• Do analysis and correlation of mold flow results to measured data.
• Develop and maintain the state of art mold flow methodology to improve the modeling work efficiency and accuracy.
• Setup and maintain the HW/SW environment for mold flow modeling.
• Provide support to other mold flow modeling users in the company.
• Innovation of new technology through simulation.
• Develop the state of art simulation methodology such as AI and machine learning algorithm, probability and optimization algorithm, digital twin, such as mold flow with thermosetting and thermoplastic materials, wire sweep and curing process.

• Bachelors or Masters or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials. 
• 10-15 years of experience in working with plastics, molds, injection molding, transfer molding, including designs and mold flow simulation.
• Knowledge and experience on thermal, mech modeling as well as process mechanics.
• Knowledge and experience of CAD concepts and Solidworks.
• Familiar with semiconductor packaging and system.
• Familiar with EMC/plastic mold and microelectronic material thermal mech properties.
• Strong knowledge of actual mold flow and curing process and performance. 
• Deep knowledge of molding process of both thermosetting with transferring molding and thermoplastic with injection molding.
• Ability to perform model correlation to empirical measurement.
• Familiar with the Unix/Linux operating system.
• Skillful in Modex3D or Mold Flow software.
• Familiar with ANSYS software.
• Strong English communication capability.
• Strong learning capability.
• Good team player.