PCB Design Senior Engineer

The Role:

We are looking for a Senior PCB Design Engineer with strong EDA library ownership and advanced high‑speed board design experience to drive the implementation of our next‑generation data center accelerator platforms.

In this role, you will be responsible for the complete PCB design process, from library definition and design rules, through floorplanning, routing, and tape‑out, while collaborating closely with Signal Integrity (SI) and Power Integrity (PI) experts to define layer stacks, PDN strategies, and constraints.

This is a hands‑on, technically demanding role focused on very high‑density, high‑layer‑count boards, pushing the limits of power delivery, memory integration, and high‑speed interfaces, using Siemens Xpedition as the primary design environment.

Key Responsibilities:

· Design and layout complex, high‑layer‑count PCBs for accelerator and data center platforms

· Own and maintain EDA libraries (symbols, footprints, padstacks, constraints)

· Define routing constraints and complex design rules for high‑speed and high‑power designs

· Collaborate with SI/PI teams on layer stack‑ups, impedance control, and PDN design

· Collaborate with mechanical and thermal experts to ensure design integration

· Drive designs from concept through tape‑out, including manufacturing deliverables

· Support DFM reviews, board bring‑up, and hardware debug activities

Required Qualifications:

· Bachelor’s and Master’s degree in Electrical Engineering or related field.

· 5+ years of hands‑on PCB layout experience in complex hardware programs.

· Strong experience with Siemens Xpedition (layout and library tools strongly preferred).

· Proven background designing high‑speed, high‑layer‑count boards.

· Solid understanding of:

-Signal Integrity and Power Integrity fundamentals

-Controlled impedance routing

-High‑density interconnects and advanced packages

· Experience creating and maintaining EDA component libraries.

· Ability to work effectively with cross‑functional teams (SI, PI, schematic, ME, manufacturing).

Preferred Qualifications:

· Experience with data‑center, accelerator, networking, or HPC hardware.

· Direct involvement in memory subsystem integration and high‑speed serial interfaces.

· Familiarity with SI/PI simulation workflows and constraint‑driven design.

· Experience defining layer stacks in collaboration with fabricators and SI/PI teams.

· Knowledge of DFM/DFT/DFX principles for high‑volume and advanced PCB manufacturing.

· Comfortable working in fast‑moving, technically ambitious engineering environments.

What do we offer?

· Join an innovative team and experience company growth.

· We believe in investing in our employees and providing them with the opportunities they need to grow and develop their careers.

· Enjoy a hybrid work environment.

· We also offer flexible schedule.

· We offer a remuneration that values your experience.

· The position will have preferably the base in Karlsruhe (Germany).

We are looking for outstanding people willing to join our mission to change this industry and help to build a better world.

If you feel identified with Openchip, please contact us. We can offer a competitive compensation package in a flexible work schema that will help you to keep a balance between your personal and professional life.

At Openchip & Software Technologies S.L., we believe a diverse and inclusive team is the key to groundbreaking ideas. We foster a work environment where everyone feels valued, respected, and empowered to reach their full potential – regardless of race, gender, ethnicity, sexual orientation, or gender identity.