Systems Architect - Integrated Quantum Chip

About Quantum Brilliance  

Quantum Brilliance is the world leader in room-temperature quantum computing using synthetic diamonds. Our unique vision is to make quantum computing available as an everyday technology, from data centres to remote and mobile systems like autonomous robots and satellites. In contrast to quantum computers that fill a room, we are developing quantum accelerators with more compute power than a classical supercomputer but in a form factor smaller than a lunchbox.  

 Founded in 2019 by leaders in diamond quantum science from the Australian National University, we are a full-stack quantum computing company. An Australia-German company, our HQs are in Canberra and Stuttgart, with additional locations across eastern Australia and southern Germany. We are working with global technology leaders to develop quantum computing applications, integrate quantum with high-performance computing, solve materials science challenges and develop ultra-precise semiconductor manufacturing and quantum control techniques. We are backed by leading venture capital funds and major research and technology institutes. 

Role overview

We are seeking a highly skilled and experienced System Architect to lead the design, simulation, and development of high-performance system-in-package (SiP) modules tailored for room-temperature diamond-based quantum computing systems. The ideal candidate possesses a deep understanding of complex system-level design, heterogeneous integration, and cross-domain system engineering to develop novel quantum product solutions. You will be responsible for translating quantum system requirements into detailed architectural specifications, guiding the design process, simulating performance, and coordinating interdisciplinary development across hardware, quantum control, and packaging technologies to deliver SiP modules that meet performance targets.

Key responsibilities

• Architect and define a SiP module for high-performance diamond-based quantum compute systems, integrating quantum and classical processors, quantum control electronics, photonic circuits, DACs/ADCs, sensors, interconnects, and thermal management components.


• Translate quantum system-level requirements into SiP-level specifications (functional, electrical, and thermal).


• Collaborate closely with quantum engineers, RF/microwave engineers, IC and control electronics designers, and packaging engineers to co-optimize the integration stack.


• Evaluate and select heterogeneous integration strategies including chiplets, 2.5D/3D packaging, advanced substrates, and interposers suitable for quantum-classical co-integration.


• Lead risk assessment, prototyping, and performance validation efforts for SiP modules, working closely with internal and external fabrication and assembly partners.


• Deliver a holistic approach to define a balanced package architecture that meets both system-level performance goals and packaging constraints.


• Lead and mentor a team of engineers and researchers involved in the design, simulation, and development of the SiP module.


• Develop and maintain technical documentation, system block diagrams, and verification plans.


• Contribute to intellectual property generation through invention disclosures and patent applications.

Required qualifications

• PhD or Master's degree in Electrical Engineering, Applied Physics, Computer Engineering or a related discipline.


• Proven experience (typically 5+ years for Master's, 2+ years for PhD) in system architecture and integration of complex electronic systems.


• Proven experience in SiP or multi-chip module design, including successful tape-outs and transition to manufacturing.


• Strong background in heterogeneous integration, co-design across PCB/package/IC boundaries, and system-level simulation (electrical, thermal, SI/PI).


• Proficient with EDA/CAD tools and multi-physics simulation platforms.


• Familiarity with quantum computing hardware architectures, particularly control stack requirements (microwave/RF, digital-to-analog conversion, feedback systems) is a plus.


• Demonstrated leadership experience in cross-functional engineering projects.


• Excellent problem-solving, communication, and collaboration skills