Bonding Process Development

Job Responsibilities

1. Responsible for the development of wafer bonding processes related to Si-based LEDs
2. Responsible for the evaluation of bonding equipment and maintenance of existing bonding equipment
3. Responsible for the development of new metal bonding structures

Qualifications

Education: Master
Work Experience:
5 years and above
1. Familiar with various bonding processes and have at least one bonding process development experience
2. Familiar with various bonding equipment and have independent operation capabilities
Required Major: Semiconductor related
Other Requirements: Have good team spirit, communication and expression skills
Language Requirements: Fluent English