Etch( Etching) Process Engineer

Job Responsibilities < /div>

1. Main work content:
(1) Responsible for Etch etching equipment Setup and process Recipe debugging (20%)
(2) Responsible for various advanced packaging and MEMS device Etch Etching process feasibility analysis, process optimization, and device process manufacturing (30%)
(3) Responsible for the formulation of preventive measures for Etch etching process defects, process defect and failure analysis, defect improvement and yield improvement (20 %)
(4) Responsible for the evaluation, selection and introduction of new Etch etching materials and new processes (20%)
2. Secondary work content:
According to project requirements, responsible for Internal/external work communication, coordination and promotion (10%)

Qualifications

Education: Bachelor's degree
Work experience: More than 2 years of Etch etching in the MEMS field Process development experience, experience in using DRIE equipment
Technical capabilities:
(1) Have DRIE equipment Setup capabilities
(2) Familiar with semiconductor DRIE equipment, and have experience in Bosch process debugging and diagnosis
(3) Familiar with the application and process requirements spec of DRIE in MEMS device manufacturing process
(4) Familiar with Etch etching materials in the semiconductor industry, with the ability to integrate resources, and can quickly find relevant resources and apply them according to needs
Required majors: automation, measurement and control, machinery, electronics, semiconductors, microelectronics, materials, physics, chemistry and other science and engineering related majors
Other requirements: good analytical and problem-solving abilities, good Team awareness and sense of responsibility