Engineer, Thermal Mechanical Simulation

Req. ID:\n\nJR94033 Engineer, Thermal Mechanical Simulation\n\nOur vision is to transform how the world uses information to enrich life for all.\n\nMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.\n\nSupport Advance Packaging development Team - Bonding \u0026 Packaging Design\n\n * Maintain knowledge in semiconductor and general electronics packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip-On-Board (COB), Flip Chip, Through Silicon Vias (TSV), etc\n * Detailed understanding of thermo compression bonding, wafer-to-wafer bonding process and the corresponding Multiphysics mechanisms involved to capture in the simulation.\n * Knowledgeable with package design processes and guidelines\n * Work with multi-functional global teams (namely Front-end design, product engineering, Technology development, Business unit, manufacturing and external programs) to fully understand and characterize manufacturing processes and packaging issues to enable simulation support with empirical validation\n * Understanding of packaging materials and their production processes. Work with internal/external vendors and testing labs to design and implement effective testing procedures to characterize materials for simulation analysis\n * Maintain an understanding of measurement methodologies and coordinate measurement data collection of packages and packaging materials for correlation and development of simulation activities\n * Provide engineering analysis to support the development and direction of the packaging materials and technologies. Develop and apply advanced design and engineering analysis to Perform Simulations\n * Use Engineering and Finite Element Analysis to support Assembly Packaging TD in the following areas: predictive analysis, design optimization, material/component testing design and hardware specifications, component\n * Use advanced analysis techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal, mechanical, and electro-mechanical simulation applications such as ANSYS, Icepak, Flotherm and others as needed\n * Improve material characterization and techniques\n * Improve simulation capabilities and techniques\n * Build simulation analysis reports using software such as Word, Excel, and PowerPoint to effectively communicate analysis results and conclusions. Effectively communicate simulation analysis reports to those needing the information to support efficient package build\n * Use standard documentation and storage tools such as SharePoint, EDC and OneDrive for the accurate and timely upkeep of Design Simulation documentation\n\n\n\nJob Profile(s):\n\nSemiconductor Design Engineer 2\n\nRelocation level: (TBD)\n\nBefore Getting Started \nPlease review Micron\u2019s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: \n\n * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.\n * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.\n\n\n\n\u200b\u200b\u200b\u200b\n\nAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc\n\nMicron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.\n