Field Application Engineer Electronic Systems Design - Bengaluru

The Role

As a Field Application Engineer — Electronic Systems Design, you will be the technical authority for GSAS's PCB design and manufacturing preparation portfolio. You'll work with hardware design teams, signal integrity engineers, manufacturing/NPI groups, and engineering managers across automotive, aerospace, defense, industrial, medical, and telecom sectors to help them evaluate, deploy, and get the most out of professional and enterprise -grade EDA tools — from schematic capture and constraint -driven layout through signal/power integrity analysis, DFM validation, and manufacturing handoff.

This role spans the full board -level design chain. You'll support customers using enterprise PCB design platforms for complex multi -layer, high -speed boards as well as teams on professional -tier tools who are stepping up from free or entry -level environments. You'll also work with manufacturing engineers and NPI teams on design -to -factory readiness — DFM analysis, test point optimization, panelization, and ODB++/Gerber validation. The common thread is that you understand what it takes to turn a schematic into a functioning, manufacturable board.

Key Responsibilities

Deliver technical demonstrations, evaluations, and proof -of -concept engagements across the full PCB portfolio — enterprise -grade schematic capture and constraint -driven layout for complex designs, professional -tier design tools for small teams and independent engineers, integrated signal integrity and power integrity analysis, and manufacturing preparation and DFM/DFA validation tools.

Guide customers through real design challenges at the board level — controlled impedance stackup design for DDR4/DDR5 and PCIe Gen3/Gen4/Gen5, differential pair routing and length matching, power delivery network optimization, via stub management and back -drilling decisions for high -frequency designs, rigid -flex definition, and design rule configuration for IPC Class 2 and Class 3 reliability requirements.

Run SI/PI analysis workflows end to end — stackup definition, IBIS model setup, pre -layout impedance planning, post -layout simulation for reflections, crosstalk, and insertion loss, PDN impedance analysis, decoupling optimization, and eye diagram generation. Correlate simulation results with lab measurements to build customer confidence in the analysis flow.

Support manufacturing preparation workflows — DFM analysis covering solder joint reliability, copper balance, drill aspect ratios, and annular ring checks. DFA validation for component placement, solder paste volume, and assembly process compatibility. Test point analysis for ICT/FCT accessibility. Panelization review and ODB++/Gerber validation before release to fabrication.

Provide pre -sales and post -sales technical support across the portfolio: tool installation and configuration, library migration from legacy and competing EDA platforms (Altium, Cadence Allegro/OrCAD, KiCad, Eagle), design rule and constraint setup, workflow optimization, and hands -on training for design teams at all levels — from a 2 -person startup moving off a free tool to a 30 -person enterprise team standardizing on a new platform.

Support customers in building enterprise -grade PCB design workflows — centralized library management with version control and role -based access, concurrent team design for large boards, ECAD -MCAD synchronization via incremental design exchange with mechanical CAD environments, and integration with requirements management and PLM systems for compliance -driven design (ISO 26262 hardware, DO -254, ITAR).

Conduct technical training sessions and workshops on PCB design best practices: stackup optimization methodology, high -speed routing strategies and constraint management, SI/PI analysis workflow and interpretation, EMC -aware layout techniques, DFM principles, and the transition path from professional -tier to enterprise -tier tools as team complexity grows.

Collaborate with the sales team on opportunity qualification, technical proposal development, competitive displacement strategies against Altium, Cadence, and free tools, and RFP responses. Provide field intelligence on competitive positioning, customer pain points, workflow gaps, and emerging design challenges.

Contribute to GSAS's technical knowledge base: application notes on SI/PI methodology, stackup design guidelines, DFM checklists, migration guides from competing platforms, design rule templates, and workshop curricula for PCB design teams across skill levels.

3–6 years of hands -on experience in PCB design, signal integrity engineering, EDA application engineering, or manufacturing/NPI engineering. You've worked on multi -layer boards with controlled impedance, high -speed interfaces, and real power delivery challenges — not just simple 2 -layer or 4 -layer designs with no speed constraints.

Strong working knowledge of PCB design fundamentals: stackup design and impedance control, differential pair routing, length matching, via modeling (including stub effects at high frequencies), power plane design and split -plane management, and DFM/DFA constraints. Experience with at least one professional EDA platform — enterprise or mid -tier — for schematic capture and layout.

Hands -on SI/PI analysis experience — not just conceptual understanding. You've set up IBIS models, run impedance simulations, analyzed reflections and crosstalk, interpreted eye diagrams, and worked through PDN impedance analysis with decoupling optimization. You can explain what you're seeing in a simulation result and what to do about it.

Familiarity with high -speed interface standards — DDR3/DDR4/DDR5 routing and timing constraints, PCIe Gen3/Gen4 channel requirements, USB 3.x/4.0, Gigabit Ethernet, LVDS — and the stackup, routing, and termination implications they carry.

Knowledge of manufacturing and assembly processes — Gerber/ODB++ generation and validation, design rule verification, IPC standards (Class 2/Class 3), solder joint reliability, assembly process constraints, and the practical back -and -forth between design engineers and fabricators/assemblers that determines whether a board is actually buildable at yield.

Experience with at least one of GSAS's core verticals — automotive electronics (ADAS, powertrain, body control), aerospace/defense avionics, telecom/networking hardware, medical devices, or industrial control systems. Understanding of compliance frameworks (ISO 26262 for hardware, DO -254, ITAR) as they relate to EDA tool requirements and design data management is a plus.

Strong communication and customer engagement skills across the full range of customer personas — you can troubleshoot a stackup impedance mismatch with a layout engineer, walk a manufacturing team through DFM findings, onboard a startup onto a professional design tool, and present an enterprise EDA migration strategy to a design director. Willingness to travel for customer engagements, training, and trade shows.

Bachelor's degree in Electronics, Electrical Engineering, or a related discipline.