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Senior/Staff Engineer Process Simulations APTD

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Job Description - Senior/Staff Engineer Process Simulations APTD

Req. ID:\n\nJR96413 Senior/Staff Engineer Process Simulations APTD\n\nOur vision is to transform how the world uses information to enrich life for all.\n\nMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.\n\nAdvanced Packaging Technology Development (APTD) at Micron Technology, Inc. is hiring a Process Simulation Engineer with strong technical expertise. The role involves process and equipment simulations for advanced semiconductor packaging, including HBM products, focusing on all aspects of packaging technology and their interactions. Collaboration with design, characterization, assembly R\u0026D, and process teams is required.\n\nResponsibilities\n\n * Partner with process engineering teams to understand semiconductor packaging processes and develop robust FEA, solid \u0026 flow simulations, and analytical simulation models.\n * Guide test vehicle development to improve simulation correlation with empirical data; develop test plans as needed to verify models and validate analysis approaches against test outcomes.\n * Participate in the development and advancement of simulation modeling methodologies across structural, thermo\u2011structural, flow, thermal, and other multiphysics domains.\n * Perform structural, thermal, and flow simulations for semiconductor packaging processes to predict behavior, assess risks, and enhance process and product performance.\n * Provide process and equipment simulation reports to support pathfinding, technology development, and product introduction.\n * Communicate FEA and flow simulation results (preferably demonstrating CFD) analysis results clearly to process engineers, providing actionable technical insights, design recommendations, and risk assessments.\n * Mentor and mature interpersonal analysis capability across structural, thermal, and flow technology domains.\n\n\n\nRequirements\n\n * Strong informative background or hands\u2011on experience in proven mechanics, finite element methods (FEA) with expertise in multiphysics modeling and simulation. Good understandings of fluid mechanics, thermodynamics, heat \u0026 mass transfer, kinetics, computational fluid dynamics (CFD) would be useful.\n * Proven ability to understand and model multiphysics interactions, including setting up integrated multiphysics frameworks for analysis, measurements, and validation in IC packaging and related areas.\n * Proven foundation in mechanics, physics, and chemistry, with emphasis on both analytical methods and measurement techniques.\n * Extensive experience with high\u2011fidelity FEA including static, multifaceted, thermal, flow, and coupled multiphysics analyses.\n * Experience in static/ dynamic/ thermal analysis and multi-physics modeling with ability to handle convergence issues due to large deformations, large strains, plasticity, creep, viscoplasticity, viscoelasticty and contact.\n * In\u2011depth knowledge of material properties, material characterization techniques, fatigue life prediction, creep damage assessment, and measurement methods relevant to IC packaging.\n * Proficiency in commercial simulation tools such as, Ansys Mechanical, APDL, ACT, DesignModeler, and SpaceClaim with experience in CAD tools (AutoCAD, SolidWorks). Knowledge of working with Ansys Fluent or Star\u2011CCM+ would be beneficial.\n * Strong understanding of semiconductor packaging processes, materials, and technology trends, including but not limited to dicing, backgrinding, die attach, PECVD, cryogenic cleaning, organic substrates, over\u2011molding materials, wire\u2011bonding, and C4 / Cu pillar attachment methods.\n * Ability to understand failure mechanisms and develop both analytical and FE\u2011based models to explain and predict failure modes.\n * Experience in defining and driving numerical and/or laboratory experiments to evaluate feasibility and validate concepts and solutions for new package technology development.\n * Strong inclination toward demonstrating AI/ML techniques to reduce simulation iterations, accelerate convergence, and improve modeling efficiency.\n * Ability to turn simulation outcomes into scalable, easy\u2011to\u2011use tools or workflows for broader engineering adoption.\n * Excellent oral and written communication skills, with the ability to collaborate optimally in multi-functional, multidisciplinary team environments.\n\n\n\nEducational Qualification:\n\n * MS/M.Tech with 6 Years or PhD with 1 to 2 years\u2019 experience\n * Mechanical Engineering, Materials Engineering, Physics, or related field\n\n\n\nJob Profile(s):\n\nSemiconductor Design Engineer 3 - Semiconductor Design Engineer 4\n\nRelocation level: (TBD)\n\nBefore Getting Started \nPlease review Micron\u2019s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: \n\n * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.\n * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.\n\n\n\n\u200b\u200b\u200b\u200b\n\nAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc\n\nMicron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.\n
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