Telematics & Connectivity Hardware

Division

R&D

Department

EV Electronics

Level

Ex

Functional Area

Telematics, Cluster, ARAS

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Job Title

Manager (R&D)

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Reporting

Leadership, R&D – EV Electronics

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Educational Qualification

Essential: B.E/ B Tech in Electrical, Electronics/Instrumentation

M Tech in Electronics is preferred; Min. 70% required at all levels of education

Experience

Minimum:  3

Maximum:  12

Age Limit

Minimum:  26

Maximum:  34

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Job Role & Responsibilities

Role:   Connectivity solutions hardware

• Design and develop automotive-grade electronic hardware for Electric Vehicle (EV) systems including Telematics Control Units (TCU), Instrument Clusters, Access Control Modules, Infotainment Systems, and connected vehicle platforms.


•   Define hardware architectures and perform circuit design for mixed-signal, high-speed digital, RF, power management, sensor interface, and communication subsystems.


•  Design and optimize RF hardware including antenna interfaces, matching networks, RF front-end circuits, filters, LNAs, protection circuits, and wireless connectivity modules supporting 4G/5G/LTE, NB-IoT, GNSS, BLE, and Wi-Fi technologies.


•  Develop robust power architectures incorporating DC-DC converters, LDOs, battery protection, and automotive transient/surge immunity circuits compliant with automotive standards.


•  Design hardware interfaces for secure elements, SIM/eSIM, memory devices, displays, touch interfaces, backlight systems, and vehicle sensors such as IMUs, radar, ultrasonic, and environmental sensors.


•  Implement and validate digital communication interfaces including CAN/CAN-FD, Automotive Ethernet, UART, SPI, I²C, USB, LIN, and high-speed serial interfaces.


•  Perform detailed schematic design, component selection, tolerance analysis, derating analysis, worst-case circuit analysis, and reliability assessments.


•  Develop complete hardware design documentation including system architecture, block diagrams, schematics, BOMs, design calculations, validation plans, and manufacturing documentation.


•  Lead PCB design activities including stack-up definition, component placement, signal integrity considerations, power integrity optimization, grounding strategy, and routing reviews.


• Design for EMI/EMC compliance through appropriate filtering, shielding, grounding, isolation, and layout techniques to meet automotive regulatory and OEM requirements.


•  Conduct circuit simulations and analyses including SPICE simulations, power integrity analysis, signal integrity evaluation, thermal assessment, and Monte Carlo simulations.


• Execute hardware bring-up, board validation, debugging, root-cause analysis, and failure investigations using laboratory instruments such as oscilloscopes, spectrum analyzers, network analyzers, logic analyzers, and power analyzers.


•  Support environmental, reliability, EMC/EMI, and regulatory qualification testing and drive corrective actions for identified issues.


•  Collaborate closely with firmware, software, mechanical, and system engineering teams to ensure seamless hardware-software integration and overall system performance.


•  Interface with semiconductor vendors, PCB manufacturers, EMS partners, and component suppliers to support prototype development, DFM/DFT reviews, production readiness, and cost optimization.


•  Drive hardware design improvements focused on reliability, manufacturability, testability, cost reduction, component lifecycle management, and production yield enhancement.


• Evaluate hardware consolidation opportunities and next-generation ECU architectures to optimize system cost, packaging efficiency, power consumption, and functional integration.

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Competency Requirements

Behavioural:

• Promotes and champions change


• Strong team player with the ability to lead/mentor group of engineers.


• Demonstrates proactive thinking, anticipating issues and taking timely action.


• Maintains high standards of technical documentation, including design calculations and engineering reports.


• Encourage technology and cost innovation within the team along with IP generation


• Ability to translate concepts into practical real-world solutions.


• Effective communication with team, peers, suppliers and leadership (written and oral communications)


• Collaborates with cross-functional teams to develop innovative solutions.

Specific expertise required for functional areas:

• Knowledge of electric vehicle standards and regulations, including ISO 26262 (Functional Safety), CISPR/ISO (EMC), ISO 7637, and AIS standards.


• Familiarity with the automotive product development lifecycle


• Strong understanding of DFSS (Design for Six Sigma) methodology.


• Strong fundamentals in analog, digital, and mixed-signal electronics.


• Proficiency in schematic design, circuit analysis, and simulations.


• Hands-on experience with PCB layout reviews, SI/PI considerations for automotive hardware.


• Experience in designing hardware for automotive-grade performance, reliability, optimization, and cost efficiency.


• Hands-on experience with LTE/4G/5G/NB-IoT modems, GNSS receivers, BLE, and Wi-Fi SoCs.


• Strong understanding of RF fundamentals including antenna design, impedance matching, return loss, VSWR, filter design, and sensitivity optimization.


• Ability to perform RF validation and troubleshoot wireless performance issues.


• Familiarity with vehicle communication protocols: CAN, LIN, UART, SPI, I2C, and related debugging/analysis tools.


• Experience building low-noise analog front ends, sensor interfaces, and signal-conditioning circuits.


• Proficient in using laboratory test equipment: Oscilloscope, DMM, LCR meter, Network Analyzer, Spectrum Analyzer, Power Analyzer, and related diagnostic tools.

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Likely Sources

Bosch, Philips, Continental, Vitesco, Valeo, Aptiv, Harman, KPIT, Denso, ZF, Hella, Honeywell, Ather, OLA, Honda, Ultraviolette, Raptee, Ford, EVA, Hero, Tata motors, Hyundai Mobis, etc