Assistant Engineer Failure Analysis

Job Description

In your new role you will:

• Prepare specimens for optical, cross-section and Scanning Electron Microscope [SEM] examination (XSEM job).
• Use the Scanning Electron Microscope [SEM] to collect images and make measurements (IFKM & IFX Construction Analysis job).
• Perform cross-section analysis using mechanical polishing, FIB, Laser preparation, Ion Miller and etc.
• Must be willing to work on 12hours rotating shift.
• Carry out routine chemical analysis and other analysis.
• Perform TEM lamella preparation.
• Compliance lab instruction, VA and APA.
• Effective pass down to next shift personnel.
• Adhere to Environmental, Safety and ESD compliance regulations.
• Ability to interface effectively with employees and laboratory customers.
• Work closely with peers and supervisor in undertaking the respective task
• Accurate data measurement.
• Safe chemical handling.
• Semiconductor processing, fabrication and testing.
• FoK Imaging, i.e. optical and SEM.

Your Profile

You are best equipped for this task if you have:

• Diploma Electrical Engineering, Chemistry, Material Science or any science discipline
• 5 years of experience in semiconductor or failure analysis field.
• Failure Analysis Field of Knowledge: Sample preparation, i.e. mechanical polishing, precision cleaving and wet chemical.

Benefits

What we offer you in Kulim

In our wafer production in Kulim we are producing more than 100.000 wafer each month.

Processing, Esd, Environmental, Chemical Analysis, Testing, Optical, Safety, Fabrication