Bilangan Pemohon
:000+
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications:
Must have either a BS or MS in Electrical Engineering, Computer Engineering, Physics or related technical field
At least 3-year experience with pre-Si validation.
At least 3-year experience with high-speed IC characterization and reliability testing.
Intermediate level understanding of the JEDEC standards and test methodologies
2+ years in IC reliability Test and Stress capability enabling.
Die packaging knowledge is an advantage.
Die sort test understanding is an advantage.
Automation skillset, and proficiency in Labview/Minitab/Python is an advantage.
1+ year(s) experience in data analytics in product reliability and risk computation
1+ year(s) experience with FI/FA of ICs.
Capable of driving the activities independently.
Clear verbal and written communication skills.
Capable of influencing technical partners based on analysis and data.
Capable to lead a small team in timely activity execution.
At least 3 years' experience with high speed circuit design, pre-silicon validation, IC characterization or reliability testing
2+ year(s) experience with testing systems and instrumentation control including hardware and software (Matlab, LabView)
Preferred Qualifications: At least 4 years' experience with high-speed and mixed-signal ICs product qualification.
2+ year experience in bench-top optoelectronic device/module or high-speed IC testing
1+ year(s) experience with photonic device or IC reliability
1+ year(s) experience with optical transceiver products.
JEDEC standards understanding at intermediate level
1+ year experience in bench-top optoelectronic device/module testing
1+ year(s) experience with reliability testing of ICs/optical components
1+ year experience with semiconductor device physics (lasers, detectors, modulators etc)
1+ year(s) experience with or knowledge of device/module FA and with analytical/characterization techniques (SEM/EDX, AFM, X-Ray imaging, IR imaging, surface analysis techniques, etc.) would be highly valuable. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
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