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End Of Line Process Engineer (Panel Level Packaging, PLP)

icon briefcase Jenis Pekerjaan : Sepenuh Masa

Bilangan Pemohon

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Mohon Sekarang
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Penerangan Pekerjaan - End Of Line Process Engineer (Panel Level Packaging, PLP)

OUR STORY




At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.




When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.




Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo,  drive innovation, and unlock their own potential. 


Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE 

  • Drive continuous process improvement for End of Line processes (Panel Release, Laser Marking and Laser Cut) by planning, evaluating, verifying, and executing procedures to ensure products meet all customer requirements for quantity, yield, and cycle time.
  • Investigate process discrepancies, perform troubleshooting and parameter optimization, and implement both short-term and long-term corrective actions.
  • Act as the main liaison between internal teams (Manufacturing, Equipment, QA) and external customers to ensure the smooth transition and implementation of process activities and improvements.
  • Prepare and maintain accurate reports and documentation related to process, materials, and customer specifications.
  • Lead cost-reduction and cycle-time improvement projects from conceptualization and planning through to execution and implementation, ensuring timely completion.

YOUR SKILLS & EXPERIENCES

  • A bachelor’s degree in electrical/Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Physics, or a related field.
  • A minimum of 2 years of hands-on experience in in Process Engineering or a related field.
  • Strong analytical, problem-solving, and project management skills.
  • Excellent communication and coordination skills for working with cross-functional teams and external customers.
  • Detail-oriented with the ability to prepare clear and precise technical documentation.
  • Proactive and results-driven with a focus on continuous improvement.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.


At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture. 



To discover more, visit st.com/careers.

Original job End Of Line Process Engineer (Panel Level Packaging, PLP) posted on GrabJobs ©. To flag any issues with this job please use the Report Job button on GrabJobs.
Mohon Sekarang
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