Engineer Package Technology - Contract

In your new role you will:

• Drive Package/leadframe 3D design development activities and ensure fulfillment of project milestone deliverables and documentation release (spec, drawing, SAP, etc).
• Responsible for the design method and design flow of new packages and leadframe based on technical capabilities of materials, processes and suppliers.
• Use AutoCAD and Inventor tools in the package development cycle. Understanding design systematics, creating 3D models and parametric control.
• Use CAD Desktop and SAP in the Inventor use case, understanding the interactions between Inventor and SAP through CAD Desktop and Metadata, revisioning file linkages, and derivations.
• Modified 2D and 3D output.
• Liaise with leadframe engineer to ensure fulfillment of all leadframe specifications and requirements.
• Participate in formulating internal design standards and specifications, design experience accumulation and sharing, and other team suggestions.
• Establish 3D package and leadframe dwg drafting guideline.

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Preferably fresh graduate / Junior with in-depth AutoCAD 2D and AutoDESK Inventor 3D Skills.
• Drafting/designing (2D/3D) Lead Frame using AutoCAD / Inventor.
• Drafting/designing (2D/3D) semiconductor package (Mold Body, Wire, Chip, Solder & etc) using AutoCAD / Inventor.
• GD&T knowledge / material specification definition.
• Strong mathematic knowledge (Algebra, trigonometry & etc) for Inventor parametric).
• Analytical and problem-solving skills.
• 12 months contract under 3rd party payroll partner and entitled to benefits according to partner company