Engineer- Work in Taiwan (Master Fresh Graduate/Degree with 3 yrs experience) - Hiring Now

We are hiring for total 20 headcounts of Engineer(E&E, Software, Chemistry background). Successful candidate will based to work in Taiwan. 

Job Scope (Semiconductor): 

As a R&D Engineer in semiconductor industry, you will be integral to advancing our FOPLP semiconductor packaging solutions. Your primary responsibilities will include evaluating PLP packaging designs, simulating product performance, designing PLP layouts, and project management. Successful hired candidate will be assigned to work in Taiwan!

Key Responsibilities:

• Evaluation of PLP Packaging Designs: Assess and evaluate various PLP packaging designs to ensure they meet production requirements, performance specifications, and industry standards.
• Product Simulation: Utilize simulation tools and techniques to analyze and predict the performance characteristics of PLP semiconductor packages under different operating conditions and environments
• PLP Layout Design: Collaborate with cross-functional teams to design and optimize PLP layouts, considering factors such as signal integrity, thermal management, and manufacturability.
• Project Management: Lead and manage projects related to packaging design, ensuring adherence to timelines, budgets, and quality standards. Coordinate with internal and external stakeholders to drive project success.

Job Scope (Automotive):

As an R&D Engineer in the automotive industry, you will lead the planning, research, and development of new technologies for automotive systems, particularly focusing on integrated design, material optical properties evaluation, electronic system integration, and innovative panel development. Additionally, you will foster cross-company and industry-academia technology cooperation to drive collaborative advancements in automotive display and user interface solutions for future technology roadmaps. Successful hired candidate will be assigned to work in Taiwan!

Key Responsibilities:

• Lead the integrated design of automotive systems, ensuring compatibility, functionality, and performance across components and subsystems.
• Evaluate the optical properties of materials used in automotive systems, including displays, panels, and interfaces, to optimize visual clarity, durability, and user experience.
• Design and develop integrated automotive electronic systems, incorporating advanced functionalities, connectivity, and compatibility with emerging technologies.
• Spearhead the development of new technologies for automotive panels, exploring innovative materials, manufacturing processes, and design approaches to enhance aesthetics, functionality, and durability.
• Foster cross-company and industry-academia technology cooperation initiatives, establishing partnerships, collaborative projects, and knowledge-sharing platforms to drive innovation and address industry challenges.
• Conduct comprehensive research and analysis of automotive display and user interface solutions, identifying trends, opportunities, and potential areas for technological advancement.
• Collaborate with internal teams, external partners, and research institutions to leverage expertise, resources, and capabilities in support of R&D objectives.
• Develop and maintain a technology roadmap for automotive display and user interface solutions, outlining short-term and long-term goals, milestones, and strategic initiatives.
• Stay updated on industry trends, emerging technologies, and competitive landscape, providing insights and recommendations to inform R&D strategies and priorities.
• Communicate effectively with stakeholders, presenting R&D findings, progress updates, and recommendations for decision-making and investment.

Qualifications:

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or related field. Master's degree preferred.
• Minimum of 3 years of experience in semiconductor packaging, or automotive design with a focus on panel level packaging for Bachelor Degree. 
• Fresh Graduate/less then 2 years working experience of Master Degree candidate are welcome to join. 
• Proficiency in packaging design evaluation, product simulation, and layout design.
• Strong project management skills, with experience leading cross-functional teams and managing projects from inception to completion.
• Familiarity with industry-standard design tools and simulation software.
• Excellent communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.
• Analytical mindset with a focus on problem-solving and continuous improvement.
• Ability to thrive in a fast-paced, dynamic environment and adapt to changing priorities.