DescriptionJob Summary:
•Manage reliability qualification and risk assessments for backend assembly manufacturing changes affecting IC and discrete semiconductor devices.
•Define, review, and execute change‑driven reliability qualification plans to support factory sustaining operations and continuous improvement initiatives.
•Provide technical reliability risk assessments for manufacturing changes, quality excursions, and customer‑reported issues.
•Support change management review boards by supplying reliability data, analysis, and technical recommendations for approval decisions.
•Lead or support reliability investigations, including qualification failures and backend process change assessments.
•Serve as a key reliability interface to support customer audits, reliability reviews, and technical inquiries.
Collaborate closely with Manufacturing, Quality, Product Engineering, and Suppliers to ensure robust, compliant, and timely change
QualificationsRequirements:
•Bachelor’s degree in Electronics, Materials Science/Engineering, Physics, Chemical Engineering, or related technical disciplines.
•3–5 years of experience in Reliability Engineering, Sustaining Engineering, Product Qualification, or Reliability Laboratory operations.
•Strong knowledge of environmental stress testing, backend assembly processes, and associated failure mechanisms.
•Hands‑on experience with reliability qualification, data analysis, and industry standards (AEC, JEDEC, MIL).
•Good understanding of IC and discrete semiconductor assembly and test flows.
•Ability to exercise independent technical judgment for change risk assessments and qualification readiness.
•Strong analytical, structured problem‑solving, and communication skills, with the ability to interface effectively with customers and auditors.
•Experience with 8D methodology, including leading cross‑functional teams through the 8D process; Lean Six Sigma Green/Black Belt is preferred.
•Familiarity with FMEA, statistical analysis, control plans, and related quality tools is an advantage.
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