External Manufacturing NPI Manager

External Manufacturing NPI Manager

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch  


• Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release       


• Responsible for the team’s performance, including overall delivery, tactical & resource planning, execution and day-to-day operationalization


• Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives  


• Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization 


• Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release 


• Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM


• Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development


• Lead by example and adoption of data analytics and data-driven approach to problem solving and decision making


• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production 

• Bachelor's Degree in Engineering/ Materials Science or equivalent technical background


• More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience 


• Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings 


• Experience in leading and mentoring a highly technical and motivated team of 10+ NPI/ process engineers   


• Hands-on assembly process experience in leading wafer technology such as SiC, JFET, GaN and CIS Imaging is highly desirable  


• Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect


• Experience in IC package design/ CAD/ simulation/ characterization will be advantageous


• Good overall understanding of OSAT business landscape, operations and industry trends


• Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills


• Proficient in statistical analysis methods and familiar with data analytics  


• Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous