Company Background
Our client is a leading multinational supplier of semiconductor production equipment and process solutions, specializing in wafer bonding and lithography technologies for advanced packaging and nanotechnology.
What to expect?
New joiners will undergo 2–3 months of training at the HQ in Austria to gain in-depth knowledge of the Company's products, with frequent overseas travel required to support projects mainly in Taiwan, Singapore and the USA.
Responsibilities:
Requirements:
Qualified and interested candidates may apply online or email your updated resume to joyce(at)talentrecruit.com.my.
Only shortlisted candidates will be notified.
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