Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies. With an expansive, state-of-the-art back-end manufacturing complex located in the Batu Berendam Free Trade Zone, Melaka, the organization supplies mission-critical semiconductor components to automotive, industrial, data center, and personal electronics markets worldwide. To drive high-volume production excellence, yield optimization, and operational discipline across its advanced packaging operations, executive leadership is seeking a high-caliber Manufacturing Section Manager for the Bump Wafer manufacturing area.
Reporting directly to the Manufacturing Director, the Manufacturing Section Manager (Bump Wafer) holds complete operational ownership of 24/7 high-volume manufacturing within the Bump Wafer area. Leading a site workforce of up to 200+ operational personnel through direct Production Supervisors, this role drives daily wafer output, line cycle times, Overall Equipment Effectiveness (OEE), scrap reduction, and cleanroom 5S discipline. As a primary line leader, the incumbent serves as the central escalation point for line disruptions and yield deviations, maintaining on-call responsiveness for critical after-hours production events.
1. High-Volume Manufacturing Execution & Line Ownership
Drive 24/7 high-volume manufacturing (HVM) operations across the Bump Wafer area, achieving daily output targets, cycle time commitments, and line productivity metrics.
Monitor and optimize Overall Equipment Effectiveness (OEE), scrap rates, wafer yield performance, and line balance across all bump process steps.
Serve as the primary operational escalation point for critical line interruptions, quality deviations, and yield excursions, maintaining on-call responsiveness after office hours to ensure shift continuity.
2. Large-Scale Operational Leadership & People Management
Lead, coach, and develop a large-scale shift workforce of up to 200+ operators and technicians via direct Production Supervisors.
Enforce shift hand-over discipline, clear performance expectations, attendance tracking, and shopfloor accountability.
Partner with HR and technical training teams to build multi-skilled technician capabilities and operator competency pipelines.
3. Process Collaboration, Lean Execution & NPI Ramp-Up
Partner closely with Process, Product, Yield, and Equipment Engineering teams to execute Lean Manufacturing, Six Sigma (6-Sigma) projects, and continuous improvement initiatives.
Facilitate smooth New Product Introduction (NPI) ramp-ups, pilot line validation trials, and technology transfer activities into full high-volume production.
Enforce strict semiconductor cleanroom safety, 5S standards, Environmental Health & Safety (EHS) policies, and statutory compliance frameworks.
Education: Bachelor’s Degree in Electrical/Electronic Engineering, Microelectronics, Mechanical Engineering, Chemical Engineering, Materials Science, or a related discipline.
Overall Experience: Minimum 5+ years of progressive semiconductor or electronics manufacturing experience (ideally under 15 years total career tenure).
Managerial Tenure: Minimum 4+ years of direct managerial or section head experience leading shopfloor manufacturing operations in a semiconductor environment.
Domain Expertise: Proven track record in back-end assembly, wafer-level packaging (WLP), or Bump Wafer manufacturing operations.
Leadership Attributes: High-energy operational presence, strong decision-making capabilities under line pressure, and demonstrated ability to lead large, multi-shift production workforces.
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