Mold Process Engineer (Operation & Sustaining)

Company Overview

Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies. The Melaka manufacturing site serves as a key global hub for high-reliability back-end packaging, assembly, and testing. To maintain zero-defect output, maximize yield, and maintain automated encapsulation systems, the Process Engineering department is seeking a hands-on Mold Process Engineer.

Position Overview

Reporting to the Mold Section Manager, the Mold Process Engineer provides daily line-sustaining, process optimization, and defect-elimination support across automated molding lines. This operational engineering role focuses on managing Epoxy Molding Compound (EMC) rheology, minimizing machine downtime, and driving root-cause defect elimination across auto-molding systems.

Key Responsibilities

1. Daily Line-Sustaining & Defect Resolution

• Provide daily process engineering support for high-volume transfer and compression molding production lines.
  

• Troubleshoot, contain, and eliminate critical molding defects—including voiding, package warpage, compound flash/bleeding, wire sweep, and package delamination.
  

• Manage Epoxy Molding Compound (EMC) parameters, evaluating compound flow, gel time, resin rheology, pellet pre-heating, and curing profiles.
  

2. Automated System Optimization & Yield Enhancement

• Maintain and optimize automated transfer and compression molding platforms (e.g., Towa, ASM, Fico systems).
  

• Apply Statistical Process Control (SPC), Design of Experiments (DOE), and 8D Root Cause Analysis to drive process stability, Cpk improvements, and yield enhancement.
  

• Qualify new EMC materials, mold chase designs, and release agents for new package conversions.
  

Requirements