RM6,000 - 9,000 monthly
Bilangan Pemohon
:000+
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Essential Duties & Responsibilities
· 3D NAND test solution design, assessment, development and maintenance, including hardware, software and data analysis.
· R&D and MP program development on multiple platforms including Advantest T5773, T5831 series, & In house designed platforms
· Test Equipment bring up and correlation for new packages including DSA design, pin & channel mapping.
· Product specific flow creation and integration to meet HVM requirements.
· R&D activities from pre-silicon to post-silicon, including Design Validation, Engineering Evaluation, Qualification Support and Failure Analysis.
· Engineering investigation and resolution on design/process/packaging issues.
· RMA failure mode analysis and screen coverage improvements.
· Test data correlation between platforms. Yield enhancement and test time optimization.
· Collaboration internally across multiple departments such as PE, Device, Packaging and Design as well as with external ATE vendors and related parties for debug and related activities.
· In house designed platform and new test equipment validation, production environment setup.
Eligibility & Qualifications
· Prior experience in ATE code development for memory testing and excellent programming skills on Java, Bash, Python, C/C++.
· Experience using bench tools including oscilloscopes & logic analyzers, knowledge ofSW Release Processes, testing methodology, DFT and DOE is a must.
· Pro-active with a CAN-DO attitude, able to accept new knowledge in a short time.
· Strong sense on team work, customer orientation, quality and discipline is highly preferred.
· Excellent leadership, communication (written and verbal), planning, organizational and problem-solving skills.
Pekerjaan ini tidak lagi menerima permohonan.
Tatal ke bawah untuk melihat kerja yang serupa .
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