New Product Transfer Technical Lead

Lead the New Product Transfer (NPT) manufacturing engineering organization within a dynamic, multi-product, multi-factory, and global environment. Provide Strategic Technical Leadership; Offer expert guidance across teams by aligning personnel, processes, and technology initiatives with organizational goals. Drive innovation and ensure technical excellence in solution design, development, and implementation. Collaborate effectively across global organizational functions to resolve technical, quality, and production challenges. Drive impactful improvements during the NPT phase and identify opportunities to enhance product design and manufacturing excellence. Continuously improving factory processes and operating systems for the manufacture of wafer fabrication equipment, focusing on production efficiency, waste reduction, cycle time, capacity, and manufacturing/design capabilities. Troubleshoot new or existing product problems, involving designs, materials, or processes. Perform root cause investigation and recommend corrective action for operational problems, such as material use variances, bottlenecks, fixture issues during build or manufacturing process. Identify opportunities to improve manufacturing processes or resolve problems and follow through resolution to reduce costs, improve product quality, and cycle time. Reviews and develops designs that improve product manufacturability and assembly. Coordinate new product builds in pilot production manufacturing partnering closely with manufacturing and product engineers. Create and release engineering drawings & bill of materials (BOM) using Engineering Change Management process. Development of handoff packages to allow flawless product transition to high volume manufacturing. Bachelor's degree in Mechanical engineering, Production Engineering, Industrial Engineering, or related field with 12+ years of experience; or Master's degree with 8+ years' experience; or equivalent experience. Proven success in New Product Introduction (NPI) and operations management—experience in wafer equipment or high-tech environments is a plus. Skilled troubleshooting capabilities in the areas of electro/mechanical assemblies.Solid understanding of manufacturing processes. Proficient in Design for Manufacturing and Assembly (DFMA) with approach to structured problem-solving and decision-making. Proficient in software applications such as CAD modeling, Product Lifecycle Management (PLM), or Product Data Modeling (PDM) systems. Experience in Engineering Change Management Process. Working knowledge in Operation Method Sheets (OMS), process planning, and Bill of Materials (BOM) Management. Solid foundation in design principles, lean manufacturing, and Kanban systems. Knowledge of Etch, Deposition, and semiconductor capital equipment; SAP manufacturing functions familiarity preferred. Experience in capital equipment forecasting and procurement for production capacity planning. Strong problem-solving mindset, continuous learning attitude, and sound decision-making skills. Knowledge of Semiconductor equipment, Capital Equipment industry and its manufacturing processes. Excellent communication and presentation skills, both written and verbal, in English. Statistical analysis skills including statistical process control and data analysis used in production setting. Knowledge in Design Failure Mode and Effect Analysis (DFMEA). Proven stakeholder management skills, with ability to influence both internal and external stakeholders or customers in technical matters.