Package Reliability Engineer/Senior Package Reliability Engineer

Detailed knowledge of semiconductor component package assembly processes and challenges Knowledge of surface mount Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies Good understanding of the effects thermomechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability Knowledge of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred Must be self-motivated, able to work independently, and detail oriented Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups Good written and verbal communication skills Strong understanding on software systems employed in backend manufacturing is a plus Minimum of BS degree, M. Sc or equivalent experience in Engineering. Any experience in Micro Electronic Packaging, Quality/Reliability Engineering, Failure Analysis, or a related field preferred.