Packaging Engineer

• Drive the optimization and establishment of robust, high -speed process parameters for diverse component attach, complex stack -ups, and advanced molding technologies (Transfer and Compression)
  
• Define and implement simplified, lean manufacturing process sequences for multi -component assembly to enhance throughput and reduce cycle time
  
• Establish stable, high -speed parameters for multi -chip attach and advanced wire bonding technologies, ensuring structural integrity and electrical performance in leaded modules
  
• Apply comprehensive technical expertise in Leadframe, Direct Bonded Copper (DBC), and MIS manufacturing to optimize module reliability and thermal performance
  

Requirements

• Bachelor’s degree in Mechanical Engineering,
  Physics, Material Science, or a related field of study
  
• Minimum 5 years -experience in the semiconductor
  field
  
• Expert level experience in process development for
  power stage, multi chip module.
  
• Package layer design expertise such as structural
  configuration, material selection and process flow design
  
• Hands on skills in operating machines and knowledge
  to down -select material, process optimization and yield improvement
  
• Expert experience of using ANSYS / FEA for stress
  modeling.
  

Benefits