Planner (Buyer) - Excellent Benefits Package

PEN S J Electronics Sdn Bhd is an advanced material manufacturer. Our company is a manufacturer and supplier to the global electronics, semiconductor, and thermal management markets. We manufacture thermal interface material which is used in high power computing (HPC) and high power HP) industries.

We are looking for an experienced and self-motivated Planner to be responsible for: 

1. Responsible for the preparation, release and tracking of the Master Production Schedule to meet customer orders. 
2. To work closely with Production, Engineering, Warehouse teams to initiate Daily Production Schedule.
3. To review daily production status report and monitor actual production against the production schedule.
4. To co-ordinate and liaise with relevant department to identify constraint , propose solution and execute plan for meeting delivery time.
5. Responsible for month end closing and reporting.
6. Requisition of raw material for production.
7. Sourcing of indirect materials.
8. Issuance of finished good for shipment. To maintain proper record and filing of the relevant documents.
9. Monitor and control all customers' order status such as delivery date and quantity and any other requirement are met.
10. Any other tasks arranged by supervisor.

QUALIFICATION/ EXPERIENCE REQUIREMENT

• Bachelor's /Master's Degree in Business Administration or relevant fields. Min CGPA 3.0
• Experienced in semiconductor packaging materials and integrated circuit manufacturing.
• > 3 years working experiences in semiconductor manufacturing production scheduling field.
• Highly organized and structured 
• Strong communicator.
• Fluent in Mandarin is a must to deal with China stakeholder
• Fluent in English.

职位描述

1. 负责编制、发布和跟踪主生产计划以满足客户订单。
2. 与生产、工程、仓库团队密切合作，制定每日生产计划。
3. 检查每日生产状态报告并根据生产计划监控实际生产情况。
4. 与相关部门协调和联络，识别约束因素，提出解决方案并执行会议交付时间计划。
5. 负责月末结算和报告。
6. 生产所需原材料的征用。
7. 间接材料采购。
8. 发出待装运的成品。
9. 妥善记录并归档相关文件。
10. 监控和控制所有客户的订单状态，例如交货日期和数量以及任何其他要求是否得到满足。
11. 负责主管安排的任何其他任务。

岗位要求

• 工商管理或相关领域的学士/硕士学位。最低CGPA 3.0
• 拥有半导体封装材料和集成电路制造经验。
• > 3年半导体制造生产调度领域工作经验。
• 高度组织化和结构化 沟通能力强。
• 必须具备流利的华文沟通能力
• 中英马听说读写能力