Job Details:

Job Description:

• Drives and develops testability and manufacturability of integrated circuits from the component feasibility stage through production ramp.
• Develop thermal solutions for new ATE handler recipe, thermal profile, DTS and thermal diode.
• Contributes to design, development, and validation of testability circuits, test flows, and methodologies for new products through evaluation, development, and debug of complex test methods.
• Interfaces with process development, fab, factory, assembly, quality and reliability, and manufacturing groups to enable post-silicon HVM ramp.
• Evaluates new designs on automatic test equipment (ATE) and works with the design, DFx, and product development teams to debug functionality and performance issues to root cause.
• Performs ATE device characterization, utilizes that data to define datasheet specifications and performs yield analysis.
• Collaborates with designers to drive design for test/debug/manufacturing (DFT/DFD/DFM) features enabling efficient production testing of new products. Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment.
• Creates and tests validation and production test hardware solutions.
• Tests, validates, modifies, and redesigns circuits to guarantee component margin to specification.
• Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.
• Ensures manufacturability over process and product design through thorough analysis of process and spec corners and works with design to resolve yield issues before manufacturing ramp.
• Drives test time reduction through analysis of fallout data versus test time for various IPs to balance and drive overall product cost optimizations.
• Analyzes early customer returns with emphasis on driving test hole closure activities.
• Creates and applies concepts for optimizing component production relative to both quality and cost constraints.
• Leads and drives manufacturing readiness from fab, assembly, and test factory to support engineering sample and customer sample generation (ES milestones), wafer start planning, product qual execution strategy and capacity analysis, and assembly and test site certification activities.
• Works with fab, assembly, and test factory partners and planners to support production ramp.
• May also manage execution of new product introductions in the fab, fab process targeting, product/process optimizations, and participate in factory task forces to bring product perspective and respond to product issues.
• Optimizes product supply through data analysis of post-silicon binsplit, die level cherry pick (DLCP), and optimize sort/test content and yield downstream through data analysis.

Qualifications:

Candidate must possess at least a BS/MS in Electrical Engineering or equivalent.

Job Type:

Regular

Shift:

Shift 1 (Malaysia)

Primary Location:

Penang 15, Penang, Malaysia

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.