Lead and guide the team in applying expertise in PCBA and RF systems for semiconductor equipment to resolve complex technical and quality challenges across the product lifecycle (Concept & Feasibility, NPI, Sustaining, EOL). Utilize Systems Engineering principles and Physics of Failure methodologies to drive robust root cause analysis and corrective actions, ensuring superior equipment functionality, component reliability, and design margins. Own accountability for quality and timely execution of supplier engineering projects, serving as the primary point of contact for assigned suppliers and ensuring alignment with Lam's standards and objectives. Travel to Lam and Lam supplier manufacturing locations to oversee assessments, audits and investigations and negotiate the implementation of systematic and lasting improvements to both products and processes. Collaborate with senior leadership to develop and execute supply chain strategies that support business continuity, scalability, and competitive advantage. Manage critical customer escalations by delivering clear, concise issue summaries and resolution plans to account teams and key stakeholders, ensuring transparency and customer confidence. Set and prioritize team objectives to balance NPI, cost, quality, capacity, and supply continuity. Align priorities across cross-functional teams and executive stakeholders to achieve company-wide goals. Drive supplier development and continuous improvement through program and project management, focusing on enhancing manufacturing and test processes, strengthening quality systems, and improving root cause and corrective action practices. Act as a strategic technical liaison between suppliers, product groups, development teams, and customer-facing teams to accelerate issue resolution and maintain customer satisfaction. Minimum Bachelor of Engineering majoring in Electrical/Mechanical/Mechatronic Engineering with demonstrated aptitude and >10 years of experience in these areas: Semiconductor equipment system and component level problem-solving knowledge. Multi-kilowatt High Power RF Environments from 1 to 60 MHz. Analog and digital electrical components including circuits, higher level assemblies, and software driven systems. Electrical measurement equipment familiarity, including: DMM, LCR, Network Analyzers, Hi-Pot/Ground Bond Testers, Function Generators, Oscilloscopes, Spectrum Analyzers. Printed Circuit Board (PCB) assembly, inspection and test. Product design and technical engineer experience in vacuum systems is beneficial. Provide Design for Manufacturability (DFM) and Design for Assembly (DFA) feedback to optimize supplier manufacturing processes and reduce Quality, Cost and delivery issues. Skilled in applying advanced quality methodologies (SPC, Cpk, DOE, GR&R, 5-Why, 8D, Ishikawa diagrams) and statistical tools (t/F tests, box plots) to drive continuous improvement. In-depth knowledge of industry standards (Semi S2, OSHA, ISO9000/14000, RoHS, UL, IEEE, MIL, IPC 610/620) and product lifecycle management from specification through high-volume manufacturing and product support. Proven ability to develop innovative solutions to complex challenges using critical and creative thinking, both qualitative and quantitative. Exceptional business communication and presentation skills, capable of influencing stakeholders at all levels and leading supplier audits and negotiations. Strong project management expertise, with experience in leading geographically diverse teams within a matrixed organization to achieve strategic objectives. Fluent in written and verbal English.
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